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The article focuses on the use of synchrotron X-rays and the recreated operational environment of a jet engine in analyzing material responses. Topics covered include the service conditions for materials such as high temperature and heat flux, the characterization of thermal barrier coatings (TBCs) and the challenges to integrating the recreated environment with the synchrotron. Also mentioned are strain response in single cycle and the effects of mechanical load.

The termal insulation of high temperature equipment may be subjected to many kinds of damages, leading to a degradation of its thermal properties. The aim of the present work was to check and predict damages that may occur during the operation of thermal equipment. This paper describes simulations and experiments that were performed in order to reproduce damages and to predict the degradation of the termal insulation by measuring temperature deviations at the outer wall of the equipment. [ABSTRACT FROM AUTHOR]

The article discusses the technique that uses microwave energy in processing high temperature materials. Microwave processing can be a substantial enhancement in reaction and diffusion kinetics, shorter time processing and high-quality products. Also presented are the advantages of the microwave process for sintering and synthesis. A successful design and building of microwave systems applicable for high temperature involves a multidisciplinary approach in which engineers are important.

The article offers information on the importance of the screen changer on the quality of extrusion. Topics include the use of a screen-pack configuration specifically for the filtration process of an operator, the use of a heavier-gauge filtration mesh screen to increase the strength of the base screen, and the issue of temperature fluctuation. It also discusses pressure fluctuation, leakage, and resin contamination and degradation.

Discusses long-term tests at high temperatures for advanced ceramics to be used in heat engines. Resistance of ceramics to oxidation and chemical change; Engineers' reluctance to use ceramics in their designs because of its brittleness and susceptibility to thermal shock; Measurement of gross temperatures using an optical method or pyrometric substances.

The article presents a case study of an ultra-high temperature mechanical testing system designed by the students and teachers of the Missouri University of Science and Technology. It stresses the importance of being able to test ultra-high-temperature ceramics (UHTCs) near their expected service temperatures to ensure their continued development. Challenges to the design are detailed, noting that the induction coil gave the most significant challenge. It also relates how to operate the system.

A practical and reliable method for the determination of thermal resistance and its' power dependence is presented. This' method requires only forward Gummel data at different ambient temperatures and at different collector-emitter bias voltages. The determined thermal resistance was successfully used to calculate the junction temperature in a DC model of a 2 × 25 μm² GaInP/GaAs HBT device. [ABSTRACT FROM AUTHOR]

The article offers information the need for expansion of the single-point data of polymer performance. Topics include the provision of properties at a single temperature in data sheets, a look into the single property of modulus, and the variability of properties in relation to temperature. It also presents tables on the acetal stress-strain curve, a comparative temperature-dependent behavior of two acetals, and modulus vs. temperature behavior from an amorphous and semi-crystalline polymer.

The article discusses the solutions to stop die buildup, also known as die drool, die bleed, or plate-out, which causes a variety of problems in the plastics extrusion process. It explains that die buildup is related to stress at the die exit, and that one way to reduce die-exit stress is through higher die and melt temperatures. It notes that the application of metallic coatings that incorporate fluoropolymers to the inside of the die also reduces stress at the die exit, which prevents buildup.

The article presents information about HyRelex, a low loss, high reliability, flexible laminates and bonding materials. HyRelex has been introduced by Taconic. The materials provide thermal, mechanical and electrical properties. These also provide superior moisture resistance. HyRelex produces low loss circuit performance because it lessens phase shift with frequency and temperature changes. HyRelex has outstanding properties. It has superb peel strength to aid in high temperature assembly operations and high power handling requirements.

Reports on the development of a high-temperature strengthening technique for carbon nanotubes by researchers at Lawrence Livermore National Laboratory, Boston College in Massachusetts and the Massachusetts Institute of Technology in Cambridge. Microelectronics application of the technique; Superelongation properties of nanotube; Potential application of the tubes.

Lists companies in the United States that manufacture heat treating equipment. Includes Control Concepts; Cooperheat Inc.; Enercon Industries Corp.

Reports on Germany-based BASF Corp.'s plans to introduce in 1996 a high performance melamine-based fiber called Basofil in the competitive market for synthetic heat and flame resistant fibers. Plant expansion plans for Basofil production; Pricing; Location of first Basofil commercial scale plant; Results of toxicological testing; Basofils' physical properties; Speculation on Basofil's market impact.

The article reports on a medical grade epoxy adhesive, Master Bond EP42HT-2ND2MED (black), that can withstand high temperatures and repeated sterilization from autoclaving.

The article offers information on the three-year project named Therminator: Modeling, Control and Management of Thermal Effects in Electronic Circuits of the Future. It notes that the project aims to maintain the strong positions obtained by the semiconductor and electronics equipment companies in Europe in highly competitive application areas. It is said that such areas tend to require semiconductor devices to work under harsh conditions with high temperatures exceeding 100 degrees Celsius.

The article refers to the conventional tube material alloys used in radiant tubes in an ethylene furnace and mentions the powder metallurgy process developed by Sandvik. The Sandvik APMT tube has an alumina-forming alloy, which can mitigage coke formation and carburization and also be applied to high-temperature environments.

The article describes a coating technology developed by Daido Steel Co. for ethylene furnace tubes. The plasma powder welding (PPW) technique produces ethylene super tubes that resist carburization and coke formation, as well as slows the rise in metal temperature during cracking operations. PPW improves performance when furnace tube service life is compared to standard high-alloy tubes.

The article reports on the invention of triple-shape materials by researchers at Massachusetts Institute of Technology and Helmholtz Association of German Research Centers. Materials can assume 3 different shapes depending on the amount of heat applied. Researchers explained that shape changes offer opportunities for applications such as intelligent stents or smart fastener systems. Intelligent stents could have an oval shape for insertion, a round shape for use or a compressed shape for removal.

The article reports on the launch of the EliteFC wafer bumping technology designed for packaging of high temperature power devices by FlipChip International. The technology is equipped with advanced thick film under-bump-metallization with low void lead-free paste technology. It is designed for high volume applications and meant to be a lower cost alternative to thin film sputtered metallization. Advantages of the product is also presented.

The article studies steel fibers and the mechanical behavior of refractory castables on drying by researchers from Sao Paulo, Brazil. The results of the study indicate that although steel fibers caused significant modifications in the castables' work-of-fracture and splitting tensile strength, especially when compared with the polyaramid-containing material, this benefit could not ensure their survival under severe drying heating schedules.

Reports on the creation of micro-sized hotplates by the researchers at Woburn, Massachusetts-based Boston Microsystems Inc. Maximum temperature resisted by the hotplates; Use of silicon carbide materials to withstand extreme heat and chemical exposure; Claim on the flexibility of the device for integration into optics, vapor deposition chambers and microreactors.

Reports that Bayer MaterialScience AG has developed rigid polyurethane foam that can withstand long-term exposure to temperatures higher than 150 degrees Celsius. Features of the insulation materials; Application of isocyanate to create a more densely cross-linked polyisocyanurate (PIR); Performance of PIR in preventing material from becoming fatigued from repeated heating and cooling.

Focuses on developments of device and packaging technologies for high-temperature automotive electronics. Failure to accomplished complex fuel control with traditional mechanical systems; Operating temperature of the electronics as defined by the automotive electronic industry; Effect of the desire of the industry to place engine control units on the engine and transmission control units.

Reports on the development by the company Kodak of microwave dissolution of crystalline material. Advantages; Use of thermally sensitive materials; Dissolution of materials by mixing solute and solvent in a vessel with heated walls; Problem with hot walls resulting from localized overheating.