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3. 8Å Tinv gate-first dual channel technology achieving low-Vt high performance CMOS

5. Record ION/IOFF performance for 65nm Ge pMOSFET and novel Si passivation scheme for improved EOT scalability

7. Metal Inserted Poly-Si (MIPS) and FUSI dual metal (TaN and NiSi) CMOS integration

8. Integration challenges for multi-gate devices

17. 25% drive current improvement for p-type multiple gate FET (MuGFET) devices by the introduction of recessed Si/sub 0.8/Ge/sub 0.2/ in the source and drain regions.

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