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In this study, an equivalent model of bonding wire used in the Ka-band quad flat no-lead (QFN) package was proposed. The proposed equivalent model was constructed using resistors and inductors according to the length of the bonding wire and the mutual inductance between the multi-bonding wires. For verification, the S-parameters derived from the equivalent model were compared with the three-dimensional (3D) electromagnetic simulation results. Moreover, a Ka-band QFN package was designed using the proposed equivalent model. The number and length of the bonding wires required to optimize the return loss (S11) and the insertion loss (S21) of the designed Ka-band QFN package were derived and applied. In the fabricated Ka-band QFN package, the S11 and S21 were measured to be −26 dB to −1.8 dB at 29 GHz, respectively, and it was confirmed that the measurement results were similar to the simulation results. [ABSTRACT FROM AUTHOR]