Ka-대역 QFN 패키지의 본딩 와이어 분석 및 설계.

In this study, an equivalent model of bonding wire used in the Ka-band quad flat no-lead (QFN) package was proposed. The proposed equivalent model was constructed using resistors and inductors according to the length of the bonding wire and the mutual inductance between the multi-bonding wires. For verification, the S-parameters derived from the equivalent model were compared with the three-dimensional (3D) electromagnetic simulation results. Moreover, a Ka-band QFN package was designed using the proposed equivalent model. The number and length of the bonding wires required to optimize the return loss (S₁₁) and the insertion loss (S₂₁) of the designed Ka-band QFN package were derived and applied. In the fabricated Ka-band QFN package, the S₁₁ and S₂₁ were measured to be −26 dB to −1.8 dB at 29 GHz, respectively, and it was confirmed that the measurement results were similar to the simulation results. [ABSTRACT FROM AUTHOR]