4 results on '"Oshida, D."'
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2. Highly reliable molecular-pore-stacking (MPS)/Cu interconnects using novel post-etching treatment (PET) for 28 nm-node and beyond.
3. Path-finding for integration of porous SiOCH films (k∼2.5) in system-LSIs.
4. Quantitative analysis of correlation between insulator surface copper contamination and TDDB lifetime based on actual measurement.
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