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124 results on '"Lo W.-C."'

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9. Heterogeneous contributions of change in population distribution of body mass index to change in obesity and underweight

10. Evaporation Pressure Control on High Crystallization Perovskite Layer via Sandwich Evaporation Technique

17. Simulation of thickness effect in thin ferroelectric films using Landau–Khalatnikov theory.

18. Consolidation in Unsaturated Soils with Body Forces

19. Morphology and electrical conduction of Si:P δ-doped layers on vicinal Si(001).

20. Effects of comorbidity and medication use on the haemodynamic status during office‐based laryngeal procedures: A prospective cohort study.

26. Electrical characterization of through silicon vias (TSVs) with an on chip bus driver for 3D IC integration.

27. Structural design, process, and reliability of a wafer-level 3D integration scheme with Cu TSVs based on micro-bump/adhesive hybrid wafer bonding.

28. Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies.

29. Cu-based bonding technology for 3D integration applications.

30. Dose-dependent effects of d-methionine for rescuing noise-induced permanent threshold shift in guinea-pigs.

32. A simple and feasible process for using multi-stage high-precision DTMs, field surveys and rainfall data to study debris flow occurrence factors of Shenmu area, Taiwan.

33. Energy performance of a solar hybrid collector system in a multistory apartment building.

43. Suspected nasopharyngeal carcinoma in three workers with long-term exposure to sulphuric acid vapour.

44. Prognostic impact of pre‐treatment neutrophil‐to‐lymphocyte ratio (NLR) in nasopharyngeal carcinoma: A retrospective study of 180 Taiwanese patients.

45. Electrical characterization and reliability investigations of Cu TSVs with wafer-level Cu/Sn-BCB hybrid bonding.

46. Electrical performances and quality investigations of integrated bonded structures and TSVs for 3D interconnects.

47. Low temperature process evaluation for 3DIC integrated thin wafer handling.

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