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Process integration for backside illuminated image sensor stacked with Analog-to-Digital Conversion chip.

Authors :
Chang, H. H.
Chien, C. H.
Lee, Y. C.
Lee, S. M.
Wang, J. C.
Huang, Y. W.
Zhan, C. J.
Hsiao, Z. C.
Tzeng, P. J.
Lee, C. H.
Chen, T. S.
Ko, C. T.
Lo, W. C.
Kao, M. J.
Source :
2014 International Conference on Electronics Packaging (ICEP); 2014, p39-43, 5p
Publication Year :
2014

Details

Language :
English
ISBNs :
9784904090114
Database :
Complementary Index
Journal :
2014 International Conference on Electronics Packaging (ICEP)
Publication Type :
Conference
Accession number :
98459099
Full Text :
https://doi.org/10.1109/ICEP.2014.6826657
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