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© Copyright 2019 American Chemical Society. Low contact resistivity ( c ) and low recombination current density at the metallized area (J 0,metal ) are the key parameters for an electron-selective contact in solar cells, and an i-a-Si:H/TiO x /low work function metal (ATOM) structure could satisfy these criteria. In this work, to achieve strong downward band bending, an Yb ( = 2.5-2.6 eV)/Ag stack is used. Moreover, the impact of (1) substrate topography (flat or textured), (2) TiO x thickness, and (3) Ti precursor (TTIP vs TDMAT) on the ATOM contact performance is investigated. The results show that the ATOM contact is relatively insensitive to the surface topography and to the Ti precursors (TTIP or TDMAT) used for the atomic layer deposition (ALD) of TiO x . However, the TiO x thickness has a significant impact on the c and marginally on the J 0,metal of the ATOM contact. For all topography cases and Ti precursors, 1 nm thick TiO x results in the lowest c value, most likely due to E F,metal depinning. In the silicon heterojunction solar cell, this ATOM contact (i-a-Si:H/TiO x /Yb/Ag) yields a solar cell efficiency of 19.2% with a high V OC of 723 mV without the need of a doped n-a-Si:H layer. Concerning the thermal stability of these contacts, TEM images confirm that Yb does not diffuse into the i-a-Si:H layer after an annealing at 180 °C for 30 min thanks to the TiO x layer behaving as a diffusion barrier. 98% of the initial solar cell efficiency is preserved even after successive annealing treatments at 150 and 175 °C, which are values in the same temperature range used in the module lamination and the sintering of the printed Ag. These results in combination with the demonstrated efficiency underline that the ATOM contact is a promising route to realize high-efficiency solar cells. ispartof: ACS APPLIED ENERGY MATERIALS vol:2 issue:2 pages:1393-1404 status: published

Metal silicide is a well-known material for contact layers; however, it has not been tested in the context of doping-free carrier selective contacts. Thin film deposition of an appropriate metal with mild annealing treatment is an interesting alternative to the more complex depositions of other compound materials. Reaction of Yb deposited on top an i-a-Si:H passivation layer results in the formation of YbSix on top of a remnant i-a-Si:H, following a low-temperature annealing below 200 degrees C. Such a contact is an interesting candidate as a doping-free electron-selective contact. Detailed investigation of the i-a-Si/YbSix contact shows that Yb thickness, i-a-Si:H thickness and silicidation annealing conditions play a significant role in determining the recombination current density (J(0,metal)) and the contact resistivity (rho(c)). Low J(0,metal) of 5 fA/cm(2) and low rho(c) below 0.1 Omega.cm were independently demonstrated for such i-a-Si:H/YbSix contacts. We also demonstrate that lowtemperature silicidation can be combined with contact sintering (160 degrees C/25 min) or module lamination (160 degrees C/20 min), which are potential pathways for process simplification. Combining the optimized i-a-SEFI/YbSix electron contact with MoOx based hole contact in the MolYSili doping-free cell (i-a-SEH/MoOx + i-a-SEFI/YbSix), we achieved 16.7% in average efficiency and 17.0% for the champion cell. Furthermore, the YbSc contact stability was evaluated at module level and excellent thermal stability of the MolYSili laminate was demonstrated using the damp-heat test method (humidity 85%, 85 degrees C, 1000 h), where the laminated MolYSili cell did not show any degradation in the cell efficiency. This is the first proof-of-concept demonstration of a stable silicide-based contact for low-temperature processed doping-free solar cells. The authors thank Pieter Lagrain, Olivier Richard, and Hugo Bender for TEM measurement. Moreover, the authors gratefully acknowledge the financial support of imec's industrial affiliation program for Si-PV. The work in this paper was partially funded by the Kuwait Foundation for the Advancement of Sciences under project number CN18-15EE01. imec is a partner in EnergyVille (www.energyville.be), a collaboration between the Flemish research partners KU Leuven, VITO, imec, and UHasselt in the field of sustainable energy and intelligent energy systems. Cho, J (corresponding author), Katholieke Univ Leuven, ESAT Dept, B-3001 Leuven, Belgium. jinyoun.cho@eu.umicore.be

Metal oxides are interesting materials for use as carrier-selective contacts for the fabrication of doping-free silicon solar cells. In particular, MoOx and TiOx have been successfully used as hole and electron selective contacts in silicon solar cells, respectively. However, it is of paramount importance that good thermal stability is achieved in such contacts. In our work, we combined i-a-Si:H/MoOx based hole contacts with electron contacts featuring i-a-Si:H/TiOx/low work function metal (ATOM) to fabricate doping-free cells, termed MoIyATOM cells. We found that the thermal stability of the ATOM contact was improved when the i-a-Si:H was annealed (300 degrees C for 20 min in N-2) before depositing TiOx (Le. pre-TiOx annealing), which reduces the hydrogen content in i-a-Si:H by about 27 Vorei, and thereby the H-related degradation of the ATOM contact characteristics. Moreover, it was found that reducing the thickness of the low-work function metal on top of the TiOx enhanced the thermal stability of the ATOM contact. With these adaptations, the MoIyATOM cell efficiency was improved by 3.5 %(abs), with the highest efficiency of 17.6%. Moreover, the cells show improved thermal stability after the above-mentioned pre-TiOx annealing, which is confirmed by annealing tests at cell level as well as damp-heat tests at module level. The insights of this study could be used to tailor other metal-oxide based electron or hole contacts. The authors thank Praveen Dara and Johan Meersschaut for ERD measurement. Moreover, the authors gratefully acknowledge the financial support of imec's industrial affiliation program for Si-PV. The work in this paper was partially funded by the Kuwait Foundation for the Advancement of Sciences under project number CN18-15EE-01. Imec is a partner in EnergyVille (www.energyville.be), a collaboration between the Flemish research partners KU Leuven, VITO, imec, and UHasselt in the field of sustainable energy and intelligent energy systems. Cho, JY (reprint author), Katholieke Univ Leuven, ESAT Dept, Kasteelpk Arenberg 10, B-3001 Leuven, Belgium; Umicore, Watertorenstr 33, B-2250 Olen, Belgium. Radhakrishnan, HS (reprint author), IMEC, Kapeldreef 75, B-3001 Leuven, Belgium. jinyoun.cho@eu.umicore.be

Utilisation of expensive silicon (Si) material in crystalline Si modules has come down to 4 g Si per watt-peak in 2018, mainly as a result of reduction in wafer thickness and kerf losses as well as increase in module efficiencies. With continued progress in conventional multi-wire sawing of ingots, wafers as thin as 100 mu m could eventually be produced. Beyond this, kerfless lift-off technologies are being investigated which enable wafer thicknesses well below 100 mu m with negligible Si kerf waste. Such thin Si wafers and foils would be much lighter in weight than today's standard 165-180 mu m-thick wafers and would exhibit considerable flexibility and fragility. This necessitates a rethink about how to handle and process thin Si into solar devices in a manufacturing line with high mechanical yield and high throughput. This paper gives a broad overview of the different approaches for fabricating solar cells on thin Si foils. In particular, three routes are discussed in detail, namely (1) freestanding processing of thin Si, (2) processing of thin Si supported mechanically on a conductive low-cost Si substrate ("wafer-equivalent" approach) and (3) processing of thin Si bonded to a transparent glass superstrate. In each case, the main challenges are explained and the recent progress in addressing them are summarised. Kerfless 50 mu m-thick epitaxial Si foils lifted-off using porous Si and thinned-down Si wafers (below 70 mu m) are used as model substrates for this work. The authors gratefully acknowledge the efforts of several people who were involved in this work over the last few years, namely Jonathan Govaerts, Stefano Granata, Menglei Xu, Ergi Donercark, Ivan Sharlandshiev, Shashi Kiran Jonnak, Shruti Jambaldinni, Robert Roozeman, Jarkko Heildcinen, Thomas Kaden, Zuzana Kovacova, Erich Neubauer, Michael Grimm and Kaori Nagaoka. The authors also acknowledge the funding received for this work from the European Commission for the H2020 project CABRISS under grant agreement No. 641972. Imec is a partner in EnergyVille (www.energyville.be), a collaboration between the Flemish research partners KU Leuven, VITO, imec, and UHasselt in the field of sustainable energy and intelligent energy systems. Radhakrishnan, HS (reprint author), Imec Vzw Partner EnergyVille, Kapeldreef 75, B-3001 Leuven, Belgium. sivarama@imec.be

A possible research path to increase the photo-generated current in silicon heterojunction (SHJ) solar cells is to replace doped layers on the front-side of the cell, which result in significant parasitic light absorption losses. MoOx is one candidate to replace the p-doped a-Si:H layer in such devices, although it is claimed to be relatively unstable to thermal treatments. We found that a MoOx film with a thickness of 6 nm is sufficient to achieve a JSC of 36 mA/cm2, which is 0.5 mA/cm2 on average higher than that of our classical SHJ reference cell. We also established a contact sintering condition for printed Ag at 160 °C after MoOx deposition, without degrading the cell performance. The champion MoOx-contacted cell yielded VOC of 724 mV and FF of 74.1%, resulting in an efficiency of 19.3%. From a detailed analysis of the interfaces of the hole contact, an interfacial a-SiOx of 1.6–2 nm was observed between a-Si:H and MoOx irrespective of the MoOx thickness (6–10 nm) before and after contact sinter annealing at 160 °C. We postulate that this a-SiOx layer acts as an interfacial dipole layer and also increases the contact resistivity at this contact. The intrinsic stability of the optimised MoOx-contacted cell is studied using a one-cell mini-module under standard damp-heat testing (85 °C/85% humidity/1000 h). More than 97 %rel of the original efficiency is maintained after 1010 h of testing, which is comparable to the behavior observed in a classical SHJ reference one-cell mini-module that was similarly tested.

We present a novel process sequence to simplify the rear-side patterning of the silicon heterojunction interdigitated back contact (HJ IBC) cells. In this approach, interdigitated strips of a-Si:H (i/p(+)) hole contact and a-Si:H (i/n(+)) electron contact are achieved by partially etching a blanket a-Si:H (i/p(+)) stack through an SiOx hard mask to remove only the p(+) a-Si:H layer and replace it with an n(+) a-Si:H layer, thereby switching from a hole contact to an electron contact in situ, without having to remove the entire passivation. This eliminates the ex situ wet clean after dry etching and also prevents re-exposure of the crystalline silicon surface during rear-side processing. Using a well-controlled process, high-quality passivation is maintained throughout the rear-side process sequence leading to high open-circuit voltages (V-OC). A slightly higher contact resistance at the electron contact leads to a slightly higher fill factor (FF) loss due to series resistance for cells from the partial etch route, but the FF loss due to J(02)-type recombination is lower, compared with reference cells. As a result, the best cell from the partial etch route has an efficiency of 22.9% and a V-OC of 729 mV, nearly identical to the best reference cell, demonstrating that the developed partial etch process can be successfully implemented to achieve cell performance comparable with reference, but with a simpler, cheaper, and faster process sequence. European Commission's Horizon 2020Framework Programme, Grant/Award Num-ber: 727523; IIAP‐SiPV; Kuwait Foundationfor the Advancement of Sciences, Grant/Award Number: P115‐15EE‐01

Copyright © 2018 John Wiley & Sons, Ltd. In this work, the ATOM (intrinsic a-Si:H/TiO x /low work function metal) structure is investigated to realize high-performance passivating electron-selective contacts for crystalline silicon solar cells. The absence of a highly doped Si region in this contact structure is meant to reduce the optoelectrical losses. We show that a low contact resistivity (ρ c ) can be obtained by the combined effect of a low work function metal, such as calcium (Φ 2.9 eV), and Fermi-level depinning in the metal-insulator-semiconductor contact structure (where in our case TiO x acts as the insulator on the intrinsic a-Si:H passivating layer). TiO x grown by ALD is effective to achieve not only a low ρ c but also good passivation properties. As an electron contact in silicon heterojunction solar cells, inserting interfacial TiO x at the i-a-Si:H/Ca interface significantly enhances the solar cell conversion efficiency. Consequently, the champion solar cell with the ATOM contact achieves a V OC of 711 mV, FF of 72.9%, J SC of 35.1 mA/cm 2 , and an efficiency of 18.2%. The achievement of a high V OC and reasonable FF without the need for a highly doped Si layer serves as a valuable proof of concept for future developments on passivating electron-selective contacts using this structure. ispartof: PROGRESS IN PHOTOVOLTAICS vol:26 issue:10 pages:835-845 status: published

A detailed investigation of the laser damage to amorphous silicon (a-Si:H) layers patterned by laser ablation (LA) and wet chemical etching is presented. This approach can be applied to pattern the rear side of silicon heterojunction interdigitated back-contact solar cells. Only the top sacrificial a-Si:H laser-absorbing layer of an a-Si:H/SiOx/a-Si:H/c-Si stack is ablated. Laser damage in the bottom a-Si:H layer and a-Si:H/c-Si interface is analyzed by both scanning electron microscopy and transmission electron microscopy. We show that the a-Si:H/c-Si passivation is degraded by laser damage and that this degradation can be diminished by increasing laser processing speed. This is attributed to a decrease of laser-irradiated area, and particularly smaller overlapping zones of adjacent laser pulses. The re-passivation quality after LA and wet etching is similar to that of as-passivated samples. This indicates that laser damage is not present in the bulk c-Si substrate but only in the a-Si:H passivation layer, which is removed during subsequent wet etching, thus allowing high quality repassivation., Marie Sklodowska-Curie Action; Epitaxial silicon foil solar cells with interdigitated back contacts 657270 — EpiSil-IBC published in physica status solidi (RRL) - Rapid Research Letters doi:10.1002/pssr.201700125

We present a novel process scheme for a-Si:H patterning using damage-free laser ablation, resulting in a simple, fast, and photolithography-free emitter patterning of silicon heterojunction interdigitated back-contact (SHJ-IBC) solar cells. An a-Si:H laser-absorbing layer and a stack of sacrificial dielectric layers are deposited on top of a-Si:H/c-Si heterocontact to prevent laser damage. Laser ablation only removes the top aSi: H layer, which limits laser damage to the surface of dielectric layers. These dielectric layers form a distributed Bragg reflector with a high reflectance of 80% at the laser wavelength which results in additional protection of the bottom a-Si:H/c-Si heterocontact. The significant reduction of laser damage is confirmed by atomic-force microscopy and photo-luminescence measurements. Such damage-free laser ablation process was successfully incorporated in a SHJ-IBC process flow and a best efficiency of 21.8% was achieved. The authors gratefully acknowledge the financial support of imec’s industrial affiliation program for Si-PV. The research leading to these results has received funding from the European Union’s Horizon 2020 research and innovation programme under the Marie Sklodowska-Curie grant agreement No 657270. This project has also received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 727523.

We present large-area n-type PERT solar cells featuring a rear boron emitter passivated by a stack of ALD Al2O3 and PECVD SiOx. After illustrating the technological and fundamental advantages of such a device architecture, we show that the Al2O3/SiOx stack employed to passivate the boron emitter is unaffected by the rear metallization processes and can suppress the Shockley-Read-Hall surface recombination current to values below 2 fA/cm2, provided that the Al2O3 thickness is larger than 7 nm. Efficiencies of 21.5% on 156-mm commercial-grade Cz-Si substrates are demonstrated in this study, when the rear Al2O3/SiOx passivation is applied in combination with a homogeneous front-surface field (FSF). The passivation stack developed herein can sustain cell efficiencies in excess of 22% and Voc above 685 mV when a selective FSF is implemented, despite the absence of passivated contacts. Finally, we demonstrate that such cells do not suffer from light-induced degradation.

Ni/Cu plated front contacts are applied to large-area hybrid silicon heterojunction (SHJ) solar cells consisting of a diffused front surface field and intrinsic and boron doped a-Si:H(i/p + ) layers forming the rear SHJ emitter. Nickel silicide front contacts are formed by excimer laser annealing (ELA) which unlike rapid thermal annealing (RTA) is shown to be compatible with a rear SHJ emitter. A top efficiency of 20.1% (externally confirmed at FhG-ISE CalLab), with j sc =39.0 mA/cm 2 , V oc =675.1 mV, and FF=76.5% is obtained on 15.6x15.6 cm 2 n-type Cz-Si in a first trial and this without compromising solder tab adhesion results at the front side. Limitations arising from series resistance at the rear side and from recombination at the front side are discussed.

A screen-printable copper paste has been developed by Dow Corning to replace the standard screen-printable silver paste for use in front busbars for solar cells. Solar cells produced with these ‘passivated copper busbars’ have shown increased conversion efficiency due to an improved device operating voltage and current while maintaining a similar fill factor when compared to cells with standard ‘fired-through’ silver busbars. In addition to the improved cell efficiency, the use of copper paste may provide major cost savings compared to the use of silver, potentially giving a very significant reduction in cost per Watt. 60-cell modules have been produced at Trina Solar with passivated copper busbars, showing similar performance to the reference modules with silver busbars. Module reliability has been shown to be well in excess of the IEC 61215 standard requirements.

Reconfigurable photovoltaic modules represent an effective solution to improve PV system resilience to partial shading. Indeed, the availability of different configurations increases energy generation under non-uniform conditions. However, the additional components that are active under uniform conditions lead to higher losses compared to equivalent static solutions. This paper presents a methodology for the design of optimized reconfigurable PV modules, balancing losses under uniform conditions and gain under partial shading. First, feasible reconfigurable module instantiations are selected given some design constraints. Then, the search space is further reduced by taking into account the typical operating conditions of the module. Finally, the best module layouts are chosen based on performance consideration. Results for a specific case study are presented to show the feasibility of the proposed methodology. The authors gratefully acknowledge imec’s SiPV industrial affiliation program and its partners. This project has received funding from the European Union’s Horizon 2020 research and innovation programme under the Marie Skłodowska-Curie grant agreement No. 751159.