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The article reports on the introduction of the Open Artwork System Interchange Standard (OASIS).MASK standard to deal the requirements particular to photomask layout representation. OASIS.MASK introduces constraints that reflect mask manufacturing's real-world limitations. The OASIS.MASK file is the layout description based on the topology, while a design database is a description based on the functions applied in a chip.

The article offers information related to the technologies industry. It states that SEMATECH Inc. developed a new three dimensional (3D) Enablement program which targets standards in inspection, metrology, and die handling. It mentions that Carl Zeiss SMS GmbH is partnering with Synopsys Inc. to establish an in-die registration metrology to be used for photomask manufacturing. It adds that Fujitsu Semiconductor Ltd. will shift its flip chip mounting technology into a group affiliate in China.

The article focuses on the establishment of photomask manufacturing process of Toppan Printing Co. Ltd. at its photomask facility in Asaka, Japan. The main goal of photomask manufacturing process is to support 32nanometer and 28nanometer semiconductor device production through its development project with International Business Machine Corp. Franklin Kalk, Toppan Photomasks chief technical officer (CTO) expects the technology will improve the production efficiency until 16nanometer logic node.