Search

Abstract: We report on normal incidence p–i–n heterojunction photodiodes operating in the near-infrared region and realized in pure germanium on planar silicon substrate. The diodes were fabricated by ultrahigh vacuum chemical vapor deposition at 600°C without thermal annealing and allowing the integration with standard silicon processes. Due to the 0.14% residual tensile strain generated by the thermal expansion mismatch between Ge and Si, an efficiency enhancement of nearly 3-fold at 1.55μm and the absorption edge shifting to longer wavelength of about 40nm are achieved in the epitaxial Ge films. The diode with a responsivity of 0.23A/W at 1.55μm wavelength and a bulk dark current density of 10mA/cm2 is demonstrated. These diodes with high performances and full compatibility with the CMOS processes enable monolithically integrating microphotonics and microelectronics on the same chip. [Copyright &y& Elsevier]