51. A new dimension for magnetosensitive e-skins: active matrix integrated micro-origami sensor arrays.
- Author
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Becker, Christian, Bao, Bin, Karnaushenko, Dmitriy D., Bandari, Vineeth Kumar, Rivkin, Boris, Li, Zhe, Faghih, Maryam, Karnaushenko, Daniil, and Schmidt, Oliver G.
- Subjects
MAGNETIC sensors ,ENHANCED magnetoresistance ,SEMICONDUCTOR technology ,SENSOR arrays ,PAPER arts ,ELECTRONIC equipment ,MAGNETIC fields - Abstract
Magnetic sensors are widely used in our daily life for assessing the position and orientation of objects. Recently, the magnetic sensing modality has been introduced to electronic skins (e-skins), enabling remote perception of moving objects. However, the integration density of magnetic sensors is limited and the vector properties of the magnetic field cannot be fully explored since the sensors can only perceive field components in one or two dimensions. Here, we report an approach to fabricate high-density integrated active matrix magnetic sensor with three-dimensional (3D) magnetic vector field sensing capability. The 3D magnetic sensor is composed of an array of self-assembled micro-origami cubic architectures with biased anisotropic magnetoresistance (AMR) sensors manufactured in a wafer-scale process. Integrating the 3D magnetic sensors into an e-skin with embedded magnetic hairs enables real-time multidirectional tactile perception. We demonstrate a versatile approach for the fabrication of active matrix integrated 3D sensor arrays using micro-origami and pave the way for new electronic devices relying on the autonomous rearrangement of functional elements in space. State-of-the-art magnetic skins can only sense in one or two-dimensions, at small spatial resolutions. By combining the ancient art of paper folding, origami, with advanced semiconductor technology, here, authors present cutting edge three-dimensional magnetic sensors. [ABSTRACT FROM AUTHOR]
- Published
- 2022
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