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We have investigated the electrical properties of a ZnO microwire grown by carbo-thermal evaporation, a ZnO thin film grown by pulsed-laser deposition on an a-plane sapphire, and a hydrothermally grown Zn-face ZnO single crystal (Tokyo Denpa Co. Ltd.). The samples were investigated by means of current-voltage measurements, capacitance-voltage measurements, and deep-level transient spectroscopy.The defects T2 [1,2] and E3 [1,3,4] were identified in all three sample types. Additionally, in the single crystal and thin film samples E64 [5] and E4 [1] were detected. These findings support the common opinion that T2 is an intrinsic defect since it is found in all the samples investigated and thus its occurrence is not related to any growth technique.

Deep-level densities of p-GaAs1−xBix and at the GaAs/p-GaAs1−xBix heterointerface have been shown to be sufficiently low for device applications based on the results of deep-level transient spectroscopy, isothermal capacitance transient spectroscopy and admittance spectroscopy. Although the metastable alloy of GaAs1−xBix is grown by molecular beam epitaxy at low temperature (370 °C), the deep-level density of p-GaAs1−xBix is suppressed such that it is on the order of 1015 cm−3. The state density at the heterointerface was determined to be 8 · 1011 cm−2eV−1, which is comparable to other III–V heterointerfaces formed at high temperatures. The surfactant-like effect of Bi is believed to prevent defect formation during low-temperature growth.

In this paper, fired and non-fired direct PECVD deposited Si-SiNx interface properties with and without NH3 pretreatment on both n- and p-type mono-crystalline silicon samples were investigated with deep-level transient spectroscopy (DLTS) measurements. A and B defect states are identified at the Si-SiNx interface. Energy-dependent electron and hole capture cross sections were measured by small-pulse DLTS. Fired samples with NH3 pretreatment show the lowest DLTS signals, which suggests the lowest overall Dit. The combination of NH3 pretreatment and firing is also suggested for application in the solar cell fabrication.

The methods of microwave-detected photo-induced current transient spectroscopy (MD-PICTS) and microwave-detected photoconductivity (MDP), which proved themselves as very successful for defect investigations in GaAs wafers, were applied to Fe-doped SI-InP samples. It was possible to observe characteristic defect levels. One important defect center showed a similar behavior as the well known EL2 defect in GaAs. This defect exhibits positive and negative PICTS signals depending on the Fe concentration. The associated activation energies show that these signals can be interpreted as an interaction of the Fe2+/3+ level in InP with both, the valence and the conduction band.Beside this major defect we discovered a wide range of shallow defects which may be important for material properties.This result and successful microwave detected photoconductivity mappings of InP wafers show that the new non-destructive investigation methods provide valuable information on defect distribution and characteristics.

The evolution of the programmed defect-state distributions in intrinsic hydrogenated amorphous silicon (a-Si:H) due to light soaking was qualitatively determined from charge deep-level transient spectroscopy. The defect-state distribution in a-Si:H was programmed by applying a particular bias voltage on the metal-oxide-semiconductor structure while annealing the structure above the equilibration temperature. The programmed distributions simulate defect-state distributions in different parts of an actual a-Si:H solar cell, particularly in the intrinsic regions close to the p/i and i/n interfaces.The defect-state distribution in the bulk of the intrinsic layer is characterized by comparable contributions from the positively charged defect states above midgap, Dh, neutral states, Dz, and negatively charged states below midgap, De. In the programmedp-type (n-type) defect-state distribution there is an excess of the Dh (De) states. Light exposure modifies the p-type distribution that evolves to a broad distribution of states with a maximum around midgap. This distribution is dominated by Dz states with substantial contributions from Dh and De states. In case of n-type distribution light soaking only slightly influences the distribution by removing a part of the Dh states and by a small increase of Dz and De states.

Computer simulations of single-junction hydrogenated amorphous silicon (a-Si:H) solar cells with different thickness of the intrinsic layer were carried out in order to study the role of charge gap states in their light-induced degradation. It is demonstrated that it is the decrease of positively charged states above midgap, Dh, and the increase of neutral states around midgap,Dz, and negatively charged states below midgap, De in the intrinsic layer that result in a drop of performance of the solar cells due to light soaking. These changes in the gap states are in accordance with our recent experimental results from the charge deep-level transient spectroscopy on undoped a-Si:H. The experimentally observed changes in the dark and illuminated J-V curves and spectral response could not be simulated with the same set of input parameters by only increasing the defect-state density in the intrinsic layer.

The charge deep-level transient spectroscopy (Q-DLTS) experiments on undoped hydrogenated amorphous silicon (a-Si:H) demonstrate that during light soaking the states in the upper part of the gap disappear, while additional states around and below midgap are created. Since no direct correlation is observed in light-induced changes of the three groups of states that we identify from the Q-DLTS signal, we believe that we deal with three different types of defects. Positively charged states above midgap are related to a complex formed by a hydrogen molecule and a dangling bond. Negatively charged states below midgap are attributed to floating bonds. Various trends in the evolution of dark conductivity due to light soaking indicate that the kinetics of light-induced changes of the three gap-state components depend on their initial energy distributions and on the spectrum and intensity of light during exposure.

We investigated the electronic properties of ZnO/CdS/CIGS/Mo/SLG polycrystalline thin-film solar cells with compositions ranging from Cu-rich to In(Ga)-rich by deep-level transient spectroscopy (DLTS) and capacitance-voltage (C-V) measurements. This compositional change represents the evolution of the film during growth by the 3-stage process. Two sets (four samples each) of CIGS thin films were prepared with Ga/(In+Ga) ratios of ∼0.3 (low Ga) and ∼0.6 (high Ga). The Cu/(In+Ga) ratio ranges from 1.24 (Cu-rich) to 0.88 (In(Ga)-rich). The films were treated with NaCN to remove the Cu2-xSe phase where needed. Key results include: (1) For lowGa devices, DLTS data show that acceptor-like traps dominate in samples where CIGS grains do not go through the Cu-rich to In(Ga)-rich transition, whereas donor-like traps dominate in In(Ga)-rich samples. Therefore, we see a clear transformation of defects from acceptor-like to donor-like traps. The activation energies of these traps range from 0.12 to 0.63 eV. We also observed that NaCN treatment eliminates a deep minority trap in the In(Ga)-rich devices, (2) For high-Ga devices, only majority-carrier traps were detected. These traps again range from shallow to deep, (3) The carrier concentration around the junction and the density of traps decrease as the CIGS becomes more In(Ga)-rich.

Deep-level transient spectroscopy (DLTS) measurements were performed on Si:Sb and Si:B n+-p step junction diodes grown by LT-MBE at various growth temperatures. The trap density dependence on growth temperature decreases with increasing temperature. However, segregation and diffusion increase with increasing temperature. Electron traps, E1 (0.42–0.45eV) and E2 (0.257eV), and hole traps, H1 (0.38–0.41eV), were found in B-doped layer grown at 370°C, 420°C, 500°C, and 600°C. These traps have been characterized by their capture cross-section, activation energy level, and trap density. The origins of the dominating electron traps are hypothesized as the association with pure divacancy defects. E1 level can be assigned for singly negatively charged divacancy V(0/-) + α and E2 level for doubly negatively charged divacancy V(-2/-).

GaAs is treated with remote PH3 and N2 plasmas. Electron traps induced by plasma treatments are investigated by isothermal capacitance transient spectroscopy measurements. The EL2 trap is detected in the as-grown GaAs. The TP1 trap(Ec-0.26eV) is generated in GaAs phosphidized for 10min, while the TN1 trap(Ec-0.66eV) is induced in GaAs nitrided for 30min. It is found that the TP1 trap is changed to the another trap with an energy level as shallow as 0.16eV below the conduction band edge and a capture cross section as small as 1.8×10−21cm2 by treating with N2 plasma subsequently after PH3 plasma treatment.

Interaction of hydrogen atoms and vacancy-related defects in 10 MeV electron-irradiated n-type silicon has been studied by deep-level transient spectroscopy. Hydrogen has been incorporated into electron-irradiated n-type silicon by wet chemical etching. The reduction of the concentration of the vacancy-oxygen pair and divacancy occurs by the incorporation of hydrogen, while the formation of the NHI electron trap (Ec – 0.31 eV) is observed. Further decrease of the concentration of the vacancy-oxygen pair and further increase of the concentration of the NH1 trap are observed upon subsequent below-band-gap light illumination. It is suggested that the trap NHI is tentatively ascribed to the vacancy-oxygen pair which is partly saturated with hydrogen.

We have characterized ZnSe material grown by chemical vapor transport in iodine using triple-axis X-ray diffraction (TAD), photo-induced current transient spectroscopy (PICTS), photoluminescence (PL), current-voltage measurements and gamma-ray spectroscopy. The material was found to have inadequate carrier transport for nuclear spectrometer use, but there was a discernible difference in performance between crystals which could be correlated with crystallinity as determined by the TAD rocking curves.

We present annealing behavior for EL2 and EL6 groups as dominant deep levels in semiinsulating GaAs using Photo Induced Transient Spectroscopy (PITS) measurement. During rapid thermal annealing, a relation has been identified between EL2 group at 0.79 and 0.82 eV and EL6 group at 0.24, 0.27 and 0.82 eV below the conduction band. It is found that they may be close in structure, and belong to the EL2 and EL6 groups, respectively. In rapidly annealed samples, the quantity of all defects in the EL2 group increases, while that in the EL6 group decreases. However, by furnace annealing at 950°C for 5 hours, some of the defects in the EL2 group break up, and the quantity of all defects in the EL6 group increases. It is suggested that the EL2 group and EL6 group are related in their microscopy structures. We then discuss a relation between the two groups and their origins.

The parameters of trapping centers in CVD diamond and Diamond-Like Carbon (DLC) films were studied by Charge Deep Level Transient Spectroscopy (Q-DLTS). The concentrations, activation energies, captures cross-section and location of the trapping centers were determined. The influence of post deposition heat treatment on the defect center parameters was studied. The Q-DLTS measurements showed that micro defects are acting as point trapping centers and have the continuous energy spectrum with one or two maximums at different energies. The nature of the trapping centers is discussed.

Deep levels in the annealed low-temperature molecular beam epitaxial (LT-MBE) GaAs layer were successfully characterized by using the capacitance deep-level transient spectroscopy (C-DLTS) as well as photocapacitance quenching technique in combination with a unique sample structure. In this work, we have fabricated the samples by inserting the LT-GaAs layer into two n-type semi-conductive layers, like a sandwich (n-LT-n structure), grown at normal substrate temperatures. DLTS measurements have revealed that one electron trap dominates the annealed LT-MBE GaAs. The dominant electron trap was very similar to the so-called EL3 level. Moreover, we found the midgap level appeared upon 800-900°C RTA, although no midgap level was detected in the as-grown n-LT-n sample (annealed at 620°C) and confirmed with photoquenching measurements that it is the EL2 level.

The interaction between EL5 and EL6 in the n-type bulk GaAs have been observed by using isothermal constant-capacitance voltage transient spectroscopy (CCVTS). Each CCVTS spectrum of EL5 and EL6 was broader than a theoretical one expected for a single level, and was found to be consistently interpreted by two main trap components. With the increase of the filling pulse duration in a wide range, one component of EL6 decreased to about 50 % of its initial value, while one component of EL5 increased and saturated. This variation in peak heights could be reversed by controlling electron occupation fractions of EL5 and EL6 by application of two adjacent filling pulses. Such interaction between both levels was commonly observed in n-type bulk GaAs independent of carrier density.

Deep levels in II-VI compounds were investigated by complementary junction and optical spectroscopy methods to assess the characteristics of the traps as well as the limits and the reliability of the techniques applied. The electrical properties have been investigated by current and capacitance transient spectroscopy, while the optical properties have been studied by cathodoluminescence. A critical and comparative analysis of the results obtained with the various methods allowed the determination of the parameters and the nature (majority or minority carrier trap) of most of the detected levels.

Electronic defects in MOCVD-grown n-type GaN were characterized by conventional deep level transient spectroscopy (DLTS) and by photoemission capacitance transient spectroscopy (O-DLTS) performed on Schottky diodes. With DLTS two deep levels were detected with thermal activation energies for electron emission to the conduction band of 0.16 eV and 0.44 eV. With O-DLTS we demonstrate four new deep levels with optical threshold energies for electron photoemission of ∼ 0.87 eV, 0.97 eV, 1.25 eV and 1.45 eV. The O-DLTS apparatus and the measurement are discussed in detail. We also report characterization of the Au-GaN barrier height of the Schottky diode by internal photoemission.

Electron traps in Czochralski–grown n-type (100) silicon with and without donor annihilation annealing have been studied by deep–level transient spectroscopy. A total of eight electron traps are observed in the concentration range 1010 –1011 cm −3. It is thought that these are grown–in defects during crystal growth cooling period including donor annihilation annealing. It is suggested that two electron traps labelled A2 (Ec–0.34 eV) and A3 (Ec–0.38 eV) of these traps are correlated with oxygen–related defects. It is shown that traps A2 and A3 are formed around 400 ° C and disappear around 500–600 ° C.

Properties of medium-deep traps in n-type undoped GaAs crystals grown by arsenic-pressure controlled Czochralski (PCZ) method were studied by using capacitance transient spectroscopy (CTS) and temperature-dependent Hall (TDH) measurement. EL3 and EL6-like (EM2) traps were dominant medium-deep traps in D LTS measurements. The dependence of EM2 peak height on the duration of filling pulse and the detailed analysis of CTS showed that the trap EM2 spectrum consisted of three electron traps which had thermal emission activation energies of approximately 0.35 eV and various capture cross sections with activation energies for electron capture. On the other hand, the trap EL6 spectrum in n-type LEC GaAs was described by two levels of traps with activation energies of 0.32 eV and 0.33 eV for electron emission, respectively. It was concluded that so-called EL6 formed a family and some of its components were classified as defects with large lattice relaxation.

Photo-Deep Level Transient Spectroscopy with 1.38 eV light reveals a new level with thermal activation energy 0.2 eV of DX centers in silicon doped Alx Ga1-xAs (x = 0.26) for the first time. The observation of this level directly proves the negative-U properties of DX centers and the existence of thermodynamically metastable state DX.

Effects of rapid thermal processing (RTP) on SiO2/GaAs interfaces have been studied with X-ray photoelectron spectroscopy, capacitance-voltage measurements and deep-level transient spectroscopy. SiO2 films of 50, 200 and 1250 nim thickness have been deposited on GaAs. RTP has been performed at 760 and 910°C for 9 s. The rapid diffusion of Ga through the SiO2 film occurs, and the As loss and the formation of the As layer near the interface are observed. The decrease of the carrier concentration occurs in all RTP samples. Five electron traps EAI (Ec – 0.27 eV), EA2 (Ec – 0.32 eV), EA3 (Ec – 0.47 eV), EA4 (Ec – 0.58 eV) and EL2 (Ec – 0.78 eV) are produced by RTP. It is considered that the production of the trap EL2 is closely related to the Ga outdiffusion into the SiO2 film and the As indiffusion from the pile-up of elemental As near the interface. Effects of SiO2 film thickness on RTP-SiO2/GaAs are also reported.

We have studied the effects of low-temperature preannealing and carbon on new donor formation at 650°C in phosphorus-doped Czochralski (CZ) silicon by deep-level transient spectroscopy (DLTS). In not preannealed carbon-lean samples, only a weak continuous DLTS spectrum often reported so far was observed. The intensity of this broad feature became significantly stronger in not preannealed carbon-rich samples. On the contrary, preannealed samples showed no such continuous spectra but two new DLTS peaks arising from shallow donor levels. Carbon enhanced the low-temperature peak, but retarded the high-temperature one. The latter peak is in strong correlation with the rodlike defect.

The point defect reactions in GaAs by which ion implant damage is removed and implanted dopants are activated remain poorly understood. Deep level capacitance transient spectroscopy (DLTS) has been used to study the effects of rapid thermal annealing (RTA) on Si-implant damage generated defects. In low implant dose samples, the results of RTA are similar to those of furnace anneals and also agree well with previous reports of boron-implanted and neutron-irradiated material. In contrast to this, higher dose samples showed much smaller than expected apparent defect concentrations. After RTA, very broad DLTS spectra and relatively little EL2 or EL3 defect formation was observed. The significance of these results with regard to the mechanisms of dopant activation and damage removal are discussed.

Uncapped and Si3N4-capped annealing of GaAs grown with the horizontal Bridgman technique was investigated with deep-level transient spectroscopy. Electron trap concentration distributions were measured with a reduced noise DLTS system to ensure reliable data. Ion implantation using Se ions both prior to capping and through a Si3N4 cap was carried out. The evolution of defect energy levels and the changes in concentration distributions with anneal temperature were studied. It is concluded that the defects residing in the probed space-charge region can be annealed out with a Si3N4 cap at a temperature higher than 750 C.

The effect of carbon incorporation into a-Si:H has been investigated in terms of gap states. The shallow and deep states are measured by a combination of two methods of the time-of-flight and the depletion discharge transient spectroscopy. The results show that the carbon incorporation of 10Z into a-Si:H leads to a slight increase in the conduction-band tail states and an extention of the deep states distribution. However, the increase in the shallow states affects little change in the electron transport properties. The origin of the deep states is also discussed.

The dependence of the DX centers thermal emission rates on the electric field has been measured by Isothermal Transient Spectroscopy (ITS) and differential ITS (DITS) techniques. These techniques allow us to achieve a more accurate analysis of these defects than the DLTS, which ability for the study of DX centers is discussed. This dependence has been found to be mainly due to a Poole-Frenkel effect and is the cause of the non-exponentiality of the thermal emission transients.

The use of deep-level transient spectroscopy for electronic defect characterization in semiconductors is reviewed with emphasis on the underlying principles and concepts.

Junction spectroscopic techniques provide a unique tool for the study of imperfections in semiconductor materials. New, fundamental defect processes have been discovered and direct observations of the role of defects in device manufacture and operation have been made. The principles of application of capacitance transient spectroscopy, electroluminescence, and SEM-charge collection microscopy are briefly reviewed. Examples of singular accomplishments of these techniques are given, and directions of future research are outlined.