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Your search keyword '"Sn-Zn alloys"' showing total 2 results
Start Over Descriptor "Sn-Zn alloys" Journal materials & design
2 results on '"Sn-Zn alloys"'

1. Design of lead-free candidate alloys for low-temperature soldering applications based on the hypoeutectic Sn–6.5Zn alloy.

Author

El-Daly, A.A., Hammad, A.E., Al-Ganainy, G.S., and Ibrahiem, A.A.

Subjects
*TIN alloys, *LEAD-free solder, *SOLDER & soldering, *EUTECTIC alloys, *ZINC alloys, *METALS at low temperatures
Abstract

Highlights: [•] Small amounts of Ni and Sb have been added into hypoeutectic Sn–6.5Zn solder. [•] Sb addition refined the microstructure and Ni enhanced the formation of (Ni, Zn)3Sn4. [•] Ni and Sb can slightly reduce the undercooling and pasty range. [•] The Sn–6.5Zn–0.5Sb alloy has the highest UTS and appropriate ductility. [•] Correlations between the microstructure and mechanical parameters were analyzed. [Copyright &y& Elsevier]

Published
2014
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2. Enhancing mechanical response of hypoeutectic Sn–6.5Zn solder alloy using Ni and Sb additions.

Author

El-Daly, A.A., Hammad, A.E., Al-Ganainy, G.A., and Ibrahiem, A.A.

Subjects
*MECHANICAL behavior of materials, *EUTECTICS, *SOLDER & soldering, *NICKEL alloys, *TIN alloys, *METAL creep
Abstract

Highlights: [•] Same amount of Ni and Sb have been added into Sn–6.5Zn solder. [•] Correlations between the microstructure and creep parameters were analyzed. [•] Ni and Sb are slightly reduced the undercooling and pasty range. [•] Sb and Ni provide about 270% and 182% higher creep resistance than Sn–6.5Zn solder. [ABSTRACT FROM AUTHOR]

Published
2013
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