Design of lead-free candidate alloys for low-temperature soldering applications based on the hypoeutectic Sn–6.5Zn alloy.

Highlights: [•] Small amounts of Ni and Sb have been added into hypoeutectic Sn–6.5Zn solder. [•] Sb addition refined the microstructure and Ni enhanced the formation of (Ni, Zn)3Sn4. [•] Ni and Sb can slightly reduce the undercooling and pasty range. [•] The Sn–6.5Zn–0.5Sb alloy has the highest UTS and appropriate ductility. [•] Correlations between the microstructure and mechanical parameters were analyzed. [Copyright &y& Elsevier]