119 results on '"Philippe, M."'
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2. The Role of Benzotriazole in Electrodeposition of Cu1−xNix Alloys (0.05 < x < 0.15) on Cu and Ni Substrates
3. Spectroscopic Ellipsometry for Operando Monitoring of (De)Lithiation-Induced Phenomena on LiMn2O4 and LiNi0.5Mn1.5O4 Electrodes
4. Implementation of Dual Number Automatic Differentiation with John Newman’s BAND Algorithm
5. Differential Inhibition during Cu Electrodeposition on Ru: Combined Electrochemical and Real-Time TEM Studies
6. The Role of Benzotriazole in Electrodeposition of Cu1-xNix Alloys (0.05 < x < 0.15) on Cu and Ni Substrates.
7. Continuous and Conformal Lithium Titanate Spinel Thin Films by Solid State Reaction
8. Implementation of Dual Number Automatic Differentiation with John Newman’s BAND Algorithm
9. Spectroscopic Ellipsometry for Operando Monitoring of (De) Lithiation-Induced Phenomena on LiMn2O4 and LiNi0.5Mn1.5O4 Electrodes.
10. High-Rate Performance Solid-State Lithium Batteries with Silica-Gel Solid Nanocomposite Electrolytes using Bis(fluorosulfonyl)imide-Based Ionic Liquid
11. Amorphous MnO2 Coated 3D Ni Nanomesh as a Thin-film Hybrid Cathode Material under O2 Atmosphere
12. Electrodeposition of Adherent Submicron to Micron Thick Manganese Dioxide Films with Optimized Current Collector Interface for 3D Li-Ion Electrodes
13. Nanometer-Thin Graphitic Carbon Buffer Layers for Electrolytic MnO2for Thin-Film Energy Storage Devices
14. The Effect of the Substrate Characteristics on the Electrochemical Nucleation and Growth of Copper
15. High-Rate Performance Solid-State Lithium Batteries with Silica-Gel Solid Nanocomposite Electrolytes using Bis(fluorosulfonyl)imide-Based Ionic Liquid
16. Amorphous MnO2 Coated 3D Ni Nanomesh as a Thin-film Hybrid Cathode Material under O2 Atmosphere
17. Electrochemical Determination of Porosity and Surface Area of Thin Films of Interconnected Nickel Nanowires
18. Copper Rich Cu1-xNix Alloys (0.05 < x < 0.15) Electrodeposited from Acid Sulfate-Based Electrolyte with Benzotriazole Additive for Microbump Metallization for 3D Stacked Integrated Circuits
19. Effects of Counter Electrode Induced Redox Cycling on Fe(III) Reduction within Microfluidic Electrochemical Cells
20. Stochastic Modeling of Polyethylene Glycol as a Suppressor in Copper Electroplating
21. High-Rate Performance Solid-State Lithium Batteries with Silica-Gel Solid Nanocomposite Electrolytes using Bis(fluorosulfonyl) imide-Based Ionic Liquid.
22. Amorphous MnO2 Coated 3D Ni Nanomesh as a Thin-film Hybrid Cathode Material under O2 Atmosphere.
23. Continuous and Conformal Lithium Titanate Spinel Thin Films by Solid State Reaction
24. Electrodeposition of Bismuth Telluride Thermoelectric Films from Chloride-Free Ethylene Glycol Solutions
25. Modeling the Bottom-Up Filling of Through-Silicon vias Through Suppressor Adsorption/Desorption Mechanism
26. Electrodeposition of Antimony, Tellurium and Their Alloys from Molten Acetamide Mixtures
27. Electrochemical Determination of the Cupric Ion Activity in Aqueous Acidic Cupric Sulfate Electrolytes
28. Electrodeposition of Adherent Submicron to Micron Thick Manganese Dioxide Films with Optimized Current Collector Interface for 3D Li-Ion Electrodes
29. Nanometer-Thin Graphitic Carbon Buffer Layers for Electrolytic MnO2for Thin-Film Energy Storage Devices
30. Copper Rich Cu1-xNix Alloys (0.05 < x < 0.15) Electrodeposited from Acid Sulfate-Based Electrolyte with Benzotriazole Additive for Microbump Metallization for 3D Stacked Integrated Circuits.
31. Electrochemical Deposition of Copper on n‐Si/TiN
32. Electroreduction of Co2 + and Ni2 + at III-V Semiconductors and Properties of the Semiconductor/Metal Interfaces Formed
33. The Effect of the Substrate Characteristics on the Electrochemical Nucleation and Growth of Copper
34. Copper Rich Cu1-xNix Alloys (0.05 < x < 0.15) Electrodeposited from Acid Sulfate-Based Electrolyte with Benzotriazole Additive for Microbump Metallization for 3D Stacked Integrated Circuits
35. Nanometer-Thin Graphitic Carbon Buffer Layers for Electrolytic MnO2 for Thin-Film Energy Storage Devices.
36. Effects of Counter Electrode Induced Redox Cycling on Fe(III) Reduction within Microfluidic Electrochemical Cells
37. Stochastic Modeling of Polyethylene Glycol as a Suppressor in Copper Electroplating
38. Modeling the Bottom-Up Filling of Through-Silicon vias Through Suppressor Adsorption/Desorption Mechanism
39. Electrodeposition of Bismuth Telluride Thermoelectric Films from Chloride-Free Ethylene Glycol Solutions
40. Electrodeposition of Antimony, Tellurium and Their Alloys from Molten Acetamide Mixtures
41. Nanometer-Thin Graphitic Carbon Buffer Layers for Electrolytic MnO2 for Thin-Film Energy Storage Devices
42. Integration of Vertical Carbon Nanotube Bundles for Interconnects
43. Electrochemical Tailoring of Catalyst Nanoparticles for CNT Spatial-Dimension Control
44. Electrochemical Tailoring of Catalyst Nanoparticles for CNT Spatial-Dimension Control
45. Effect of Additives on Shape Evolution during Electrodeposition
46. Effect of Additives on Shape Evolution during Electrodeposition
47. Effect of Additives on Shape Evolution during Electrodeposition
48. Electrochemical Characterization of Adsorption-Desorption of the Cuprous-Suppressor-Chloride Complex during Electrodeposition of Copper
49. Electrochemical Characterization of Adsorption-Desorption of the Cuprous-Suppressor-Chloride Complex during Electrodeposition of Copper
50. Electrodeposition of Bi[sub 1−x]Sb[sub x] Thin Films
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