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The Role of Benzotriazole in Electrodeposition of Cu1-xNix Alloys (0.05 < x < 0.15) on Cu and Ni Substrates.
- Source :
- Journal of The Electrochemical Society; May2022, Vol. 169 Issue 5, p1-12, 12p
- Publication Year :
- 2022
-
Abstract
- We investigated the benzotriazole enabled growth of low Ni content (5-15 at.%) CuNi alloy deposits by characterisation of its morphology and elemental composition as a function of substrate metal (Cu and Ni), charge density, current density, and potentialtime response measured during electrodeposition. Alloy deposition starts in favor of Cu, forming a Cu-rich layer on a Ni substrate and Cu-rich islands on a Cu substrate after which aggregates only form on a Cu substrate, due to the ability of benzotriazole (BTAH) to chemically bond to Cu but not to a Ni surface. Furthermore, Ni deposits preferably on grain boundaries, BTAH gets incorporated in the deposit and forms a thin layer between the Cu substrate and the alloy deposit. Based on our findings a growth model for BTAH enabled CuNi growth is proposed which describes that the BTAH working mechanism is twofold. First, the additive shifts the onset potential of Cu2+ reduction closer to the Ni2+ reduction potential by forming a chemisorbed BTAH layer, thereby enabling Cu and Ni co-deposition and, secondly, during deposition it specifically interacts with Cu, thus inhibiting Cu dendrite formation. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 00134651
- Volume :
- 169
- Issue :
- 5
- Database :
- Supplemental Index
- Journal :
- Journal of The Electrochemical Society
- Publication Type :
- Academic Journal
- Accession number :
- 156925478
- Full Text :
- https://doi.org/10.1149/1945-7111/ac35fa