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Several miniaturized viscometers, or microviscometers, have been developed exploiting numerous rapid prototyping techniques. Among them, paper microstrips, famously known as microfluidic paper-based analytical devices ( $\mu $ PADs), have become popular due to their cost-efficacy, simple fabrication, fast response, and easily disposable. Many fabrication methods are existing to develop paper microstrips. Herein, an alternative fabrication method is proposed where fused deposition modeling (FDM)-based 3-D printer (3DP) has been employed using polycaprolactone (PCL) filament. F, image processing has been utilized to measure viscosity in such microfluidic domain. Viscosity was calculated by measuring the time taken by the fluid to cover a fixed length between two spots in the microchannel based on the programed and color-coded regions-of-interest. The image processing program was developed considering the change in the gray scale in the virtual region of interests (ROIs) in the microchannel during the fluid flow in the paper microstrips. A 3-D printed handheld platform, containing raspberry pi with on-board camera and display, was developed to execute the image processing and automate the entire work flow. In the proposed device, the accuracy was measured to be >92%.

Various miniaturized viscometers have been developed utilizing several fabrication methods. Among them, microfluidic paper-based analytical devices ( $\mu $ PADs) are becoming popular due to their fabrication ease, cost-effectiveness, and the fact that the flow can be carried out using the embedded capillaries themselves. Mostly, $\mu $ PADs are reported to be fabricated by a solid-ink printer, which has significantly high capital and operational cost. To overcome such drawbacks, a novel rapid prototyping method has been proposed, wherein the formation of the hydrophobic regions was created by polycaprolactone (PCL) filament using a 3-D printer. To leverage this, $\mu $ PAD as a viscometer, velocity, or time between two points with known distances was required, which was carried out by an amperometric approach, established by fabricating the integrated screen-printed electrodes intersecting the microchannel of the $\mu $ PAD. The time measurement was fully automated by a microcontroller, and the relative viscosity was calculated by comparing the time taken by the reference fluid with that of a test fluid to cover a known length. Such integrated, automated, and low-cost paper-based microviscometer was leveraged to measure and analyze the viscosities of various milk variants, which has an accuracy of >92%.

We demonstrate edge electron emission from flexible free-standing graphene paper (GP). The turn-on field is measured at 2.2 V/ $\mu{\rm m}$ , and the maximum emission current density at 3 ${\rm A}/{\rm cm}^{2}$ . The field emission properties of GP can be optimized by adjusting the thickness and annealing temperature. Because it is flexible, it can be shaped into different forms to meet the requirements of specific applications. The electron beam shape can range from a sheet electron beam to a cylindrical (hollow) electron beam.

Since 2017, the IEEE Transactions on Electron Devices (TED) has published a selection of extended versions of papers presented at the Symposia on VLSI Technology and Circuits held in the corresponding years (vol. 64, no. 10; vol. 65, no. 11; vol. 66, no. 12). Since 2018, the papers have been collected in a Special Section of TED titled “Papers from Symposium on VLSI Technology.” This initiative, which was the result of a fruitful cooperation between the Electron Device Society and the VLSI Symposium chairs and committees, has brought to TED a number of carefully selected (by the VLSI TPC first and then through the TED usual review process), high-quality submissions. We have been able to continue this cooperation also in this difficult 2020, and we are therefore happy to announce the publication in the December issue (Vol. 67, No. 12) of a Special Section on papers from the 2020 Symposium, held virtually on June 15–19, 2020. A special thanks to the Guest Editors of the section, Peide Ye, Purdue University (Publication Chair, 2020 VLSI Symposium), and Masaharu Kobayashi, The University of Tokyo, Japan (Publication Co-Chair, 2020 VLSI Symposium).

We report on investigation of the mechanical properties of paper electronics (printed and made out of paper). One key objective of such paper electronics is to achieve ultraflexibility. Therefore, it is important to understand electrical functionality and reliability of paper electronics under various physical (mechanical) deformations. Here, we show the general mechanical properties of the cellulose paper used and its electrical behavior under applied strain, tackling the main effects that need to be identified when building paper-based systems, from product performance and stability perspective. An overview of the stress–strain behavior of silver ink on paper is discussed, and then, we tackle a more specific analysis of the performance variations of paper sensors made with recyclable household materials when exposed to various mechanical conditions of tensile and compressive bending. This paper is important for developing stable wearable sensors for incorporation into Internet of Everything applications.

During the past few years, we have seen an increasing number of submissions of “physics-based simulation only” papers to the IEEE TRANSACTIONS ON ELECTRON DEVICES (T-ED). The popularity of such papers may be explained by the fact that the present widespread technology computer-aided design (TCAD) tools are a significant and welcome boost to creativity in the electronic device community. In fact, TCAD tools allow researchers to explore and optimize device structures without being burdened by technology concerns in terms of availability, cost, and time delay.