Highlights the papers presented at the 51st Electronics Components and Technology Conference in Orlando, Florida from May 29 to June 1, 2001. 'Over GHz Power RF Clock Distribution for a Multiprocessor Digital System'; 'Modeling and Simulation of Core Switching Noise for ASICs'; 'A Quasi Three-Dimensional Distributed Electromagnetic Model for Complex Power Distribution Networks.'
The article puts forward the various contributions from the 11th Topical Meeting on electrical performance of electronic packaging. The meeting was held at the Hyatt Regency Hotel, Monterey, California on October 21-23, 2002. It was attended by over 160 people from twelve countries. It provides the most comprehensive and in-depth forum for the presentation and discussion of the latest advances in electric design, analysis and characterization of on-chip and packaging interconnections and structures for digital, mixed signal and microwave applications.