Foreword Contribution from the 11th Tropical Meeting on Electrical Performance of Electronic Packaging.

The article puts forward the various contributions from the 11th Topical Meeting on electrical performance of electronic packaging. The meeting was held at the Hyatt Regency Hotel, Monterey, California on October 21-23, 2002. It was attended by over 160 people from twelve countries. It provides the most comprehensive and in-depth forum for the presentation and discussion of the latest advances in electric design, analysis and characterization of on-chip and packaging interconnections and structures for digital, mixed signal and microwave applications.