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We demonstrate solution-processed hybrid ambipolar thin-film transistors (TFTs) employing a stack structure composed of indium–gallium–zinc-oxide (IGZO) and single-wall carbon nanotube (SWCNT) as an active channel fabricated at low temperature. With an optimized deep-ultraviolet (DUV) photo annealing process for sol–gel based IGZO thin film on SWCNT random networks, the ambipolar transport of both electrons and holes with good electrical characteristics was realized. We also investigate the effect of DUV photo annealing on the material characteristics of solution-processed hybrid stack films and on the device performance of solution-processed hybrid ambipolar TFTs compared to those of samples thermally annealed at 500 °C, which is required for solution-processed high-quality IGZO thin films. The Raman spectra show that DUV photo annealing ensures hole transport in SWCNT random networks of a hybrid stack film, where the intensity of the 2D peak to the G peak was not changed compared to that of pristine SWCNT random networks. We believe that these analytical investigations reveal that DUV photo annealing is a promising method by which to realize hybrid ambipolar SWCNT/IGZO TFTs fabricated at low temperature.

We demonstrate a simple and reproducible method of solution-processed fluorocarbon encapsulation which significantly improves the device performance of molybdenum disulphide (MoS2) thin-film transistors (TFTs) operating at low voltages. Using such encapsulation, the key factors of the device, such as field-effect mobility, sub-threshold swing and device-to-device uniformity were improved. This achievement is presumed to stem from the screening effect of fluorocarbon, poly(vinylidene fluoride-co-trifluoroethylene) (PVDF-TrFE) which possesses a chemical structure with polarizable interactions of carbon–fluorine (C–F) bonds in the end groups, on the scattering of charge impurities in MoS2 TFTs. We also investigate the Raman spectra to verify the effects of solution-processed fluorocarbon encapsulation on the structure of MoS2 thin films where the decreases in the intensity levels of E2g and A1g were observed without a shift in the peak. We believe that such a screening method can be a promising approach to recover the intrinsic electrical characteristics of MoS2 TFTs for nano-electronics with low power consumption.

The material compositions of oxide films have been extensively investigated in an effort to improve the electrical characteristics of dielectrics which have been utilized in various electronic devices such as field-effect transistors, and storage capacitors. Significantly, solution-based compositions have attracted considerable attention as a highly effective and practical technique to replace vacuum-based process in large-area. Here, we demonstrate solution-processed composite films consisting of aluminum oxide (Al2O3) and boron nitride (BN), which exhibit remarkable dielectric properties through the optimization process. The leakage current of the optimized Al2O3–BN thin films was decreased by a factor of 100 at 3V, compared to pristine Al2O3 thin film without a loss of the dielectric constant or degradation of the morphological roughness. The characterization by X-ray photoelectron spectroscopy measurements revealed that the incorporation of BN with an optimized concentration into the Al2O3 dielectric film reduced the density of oxygen vacancies which act as defect states, thereby improving the dielectric characteristics.

High performance of solution-processed, single-wall-carbon-nanotube (SWCNT) thin-film transistors (TFTs) is investigated through the use in the different gatedielectrics of silicon dioxide (SiO2), silicon nitride (SiNx), the bilayers of SiO2 and SiNx, and hexagonal boron-nitride (h-BN) thin films. The different interfacial characteristics affect the electrical characteristics of the SWCNT-TFTs including key device metrics. Significantly, the hysteresis window that is normally observed in drop-casted SWCNT-TFTs was majorly suppressed by the employment of a thin lower dielectric-constant material on a higher dielectricconstant material. Sub-2V operating SWCNT-TFTs with solution-processed h-BN gate dielectrics with good above- and sub-threshold characteristics are also investigated on the basis of interfacial characteristics underlying the device physics. Such performance can be realized by the suppressed interfacial impurity scattering through the chemically clean interface combined with optimized solution-process below 100 °C.

We report on the restoration of the electronic characteristics of waferscale chemical vapor deposition (CVD) monolayer graphene field-effect transistors (GFETs) by reducing the impurity concentration. An optimized electropolishing process on copper foils combined with carbon-fluorine encapsulation using a suitable amorphous fluoropolymer enables reducing the surface roughness of graphene and screening out interfacial impurity scattering, which leads to an improvement in all key device metrics. The conductivity at the Dirac point is substantially reduced, resulting in an increase in the on-off current ratio. In addition, the field-effect mobility increased from 1817 to 3918 cm2/V-s, the impurity concentration decreased from 1.1 × 1012 to 2.1 × 1011 cm−2 and the electron and hole transport became more symmetric. Significantly, favorable shifts toward zero voltage were observed in the Dirac point. We postulate that the smoother surface due to electropolishing and a pool of strong dipole-dipole moments in the flouropolymer coating provide a charge buffer that relaxes the fluctuation in the electron-hole puddles. We also investigate the long-term stability in GFETs encapsulated with fluoropolymer, which exhibit a high hydrophobicity that suppresses the chemical interaction with water molecules. Open image in new window