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In this Letter, an enhancement mode (E-mode) β-Ga2O3 metal-oxide-semiconductor field-effect transistor (MOSFET) with quasi-two-dimensional channel was reported, and the channel mobility of 147.5 cm2/(V·s) is achieved. Low damage etching technology and low Ohmic contact resistance technology are introduced. As a result, the E-mode transistor demonstrates a maximum drain to source current (ID) of 230.5 mA/mm, a peak transconductance (Gm) of 54.2 mS/mm, a current gain cut-off frequency (fT) of 18 GHz, and a power gain cut-off frequency (fMAX) of 42 GHz. Additionally, a positive threshold voltage (VT) of 1.65 V, a breakdown voltage (VBK) of 420 V, and a specific on-resistance (RON,SP) of 1.24 mΩ·cm2 are achieved. Moreover, a fMAX × VBK of 17.64 THz·V and a fT × VBK of 7.56 THz·V are found to be a close value so far to the theoretical limit of β-Ga2O3. This device leads to excellent radio frequency (RF) characteristics, which paved the way for future millimeter-wave RF power electronics applications with β-Ga2O3 MOSFET. [ABSTRACT FROM AUTHOR]

This Letter reports two kinds of oxygen-containing plasma treated β-Ga2O3 Schottky barrier diodes (SBDs), including N2O plasma treatment and O2 plasma treatment, and the SBD without plasma is prepared for comparison. I–V characteristics, breakdown characteristics, and trap state characteristics of three devices have been studied. It is found that the turn-on voltage of SBDs with N2O plasma can reduce to 0.6 V, and the better current density of 750 A/cm2 and an on-resistance of 3.5 mΩ cm2 are obtained after the N2O plasma treatment. Moreover, the breakdown voltage of SBDs with N2O plasma is 50.2% higher than the conventional one, whose value reaches 323 V. In addition, the trap states' characteristics of the devices are studied, which show that the oxygen-containing plasma can reduce the deep level trap states density partly in the anode region, which can improve the surface quality effectively. [ABSTRACT FROM AUTHOR]

A β-Ga2O3 Schottky barrier diode (SBD) with a p-type NiOx guard ring was fabricated, and the reverse leakage and subthreshold leakage current reduction was found at high temperatures from temperature-dependent I–V characteristics. The functional mechanisms of NiOx as edge termination on leakage reduction were studied. NiOx can increase the barrier height and passivate the defects at the interface, resulting in the suppression of subthreshold leakage and elimination of current crowding effect confirmed by a thermal emission microscope. From the temperature-dependent x-ray photoelectron spectroscopy characteristics, more holes generated to deplete Ga2O3 at higher temperatures were found. It leads to reduce the reverse leakage current. The small-polaron transportation in NiOx is proposed to argue the implausibility of the leakage conduction in NiOx. This work will offer critical physical insight and a valuable route for developing low-leakage Ga2O3 SBDs. [ABSTRACT FROM AUTHOR]

A low temperature controlled annealing technique was utilized to improve the performance of vertical β-gallium oxide (β-Ga2O3) Schottky barrier diodes (SBDs) in this work. The nickel is diffused into Ga2O3, and NiO was formed at the interface between the anode and semiconductor generating p–n junction after low temperature annealing. Simultaneously, the trap state density of interface Ni/Ga2O3 as well as the carbon bonded with oxygen on the surface was reduced, which was proved by the capacitance and conductance measurements and x-ray photoelectron spectroscopic analysis, respectively. Combined the decreased saturation current density by three orders of magnitude from 1.21 × 10−6 to 9.27 × 10−8 and 5.12 × 10−9 A/cm2 and larger breakdown voltage from 220 to 270 V owing to the optimized interface and the formation of NiO, a low temperature annealing technique makes certain effective improvement for vertical β-Ga2O3 SBDs via interface engineering. [ABSTRACT FROM AUTHOR]