Conventional and future electronic packages merge several different materials. Polymers, metals, solders, dielectrics, glasses, silicon, composites come together and show strong mechanical and material interaction. These interfacial effects increase if the miniaturization and diversification keep on rising as it is proposed. Many efforts have to be done to assure the system reliability of new electronic packages. The Finite Element Simulation has the ability to support the development process of new packages. The application of the FEM‐analysis requires the knowledge about the precise mechanical and thermal behaviour of the materials. The paper presents different measurement methods to determine accurate mechanical material properties of moulding compound polymers, underfillers, solder mask, and wafer photo resist and solder joints. The temperature dependency is essential to be respected. The polymer materials moulding compound as well as solder mask were characterized by Dynamic Mechanical Analysis under humidity influences to determine mechanical properties as function of moisture and temperature. Further experiments on polymer were conducted to extract the cure kinetics by Differential Scanning Calorimetry and to determine Bulk Modulus by Pressure‐Volume‐Temperature experiments (PVT). Altogether, these material properties need to be modeled in a comprehensive way fitting to each other. The common practice of just compiling data from different sources has been found to fail yielding in reliable and accurate results. The conditions under which the data were determined may cause mismatches between them and cause inconsistencies within the model. If a convergent solution was obtained at all, much simulation time would be needed as many iterations with small time steps were needed. In order to avoid this, the paper reports an approach of characterizing the temperature and time dependent mechanical material properties in one comprehensive scheme. The solder measurement allows the determination of material properties within a temperature range of 20 °C–200 °C. Further, the time dependent creep deformation can be measured within a strain‐rate range of 10−3 1/s–10−8 1/s. Solder alloys based on Sn‐Ag/Sn‐Ag‐Cu with additionally impurities and joint sizes down to O/ 200 μm were investigated. To finish the material characterization process the material model coefficient were extracted by FEM‐Simulation to increase the accuracy of data.Conventional and future electronic packages merge several different materials. Polymers, metals, solders, dielectrics, glasses, silicon, composites come together and show strong mechanical and material interaction. These interfacial effects increase if the miniaturization and diversification keep on rising as it is proposed. Many efforts have to be done to assure the system reliability of new electronic packages. The Finite Element Simulation has the ability to support the development process of new packages. The application of the FEM‐analysis requires the knowledge about the precise mechanical and thermal behaviour of the materials. The paper presents different measurement methods to determine accurate mechanical material properties of moulding compound polymers, underfillers, solder mask, and wafer photo resist and solder joints. The temperature dependency is essential to be respected. The polymer materials moulding compound as well as solder mask were characterized by Dynamic Mechanical Analysis under...