54 results on '"R. Gaddi"'
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2. Fashion, identity and culture in the Chinese fashion system. China, inspiration for Chinese fashion designers
3. High-Linearity 5.3-7.0 GHz 3-Pole Tunable Bandpass Filter Using Commercial RF MEMS Capacitors
4. 4D Designing Development Developing Design. Conference Proceedings
5. Multiband antenna operation with a non-resonant element using a reconfigurable matching network
6. Experimental Validation of Mixed Electromechanical and Electromagnetic Modeling of RF-MEMS Devices Within a Standard IC Simulation Environment
7. RF–MEMS wafer-level packaging using through-wafer interconnect
8. A 1–1.2 GHz RF MEMS VCO with accurate noise characterization
9. Symmetric toggle switch—a new type of rf MEMS switch for telecommunication applications: Design and fabrication
10. Electromagnetic optimization of an RF-MEMS wafer-level package
11. High-power time-domain measurement system with active harmonic load-pull for high-efficiency base-station amplifier design
12. Nonlinear modelling of reconfigurable microwave components based on resistive MEMS switches
13. Large-Signal Vectorial Load–Pull Characterization of MEMS RF-Actuation
14. Efficient Pre-stressed Harmonic Analysis of RF-Microresonators by Means of Model Order Reduction
15. Reliability issues in RF-MEMS switches submitted to cycling and ESD test
16. NODAL MODELLING OF UNEVEN ELECTROSTATIC TRANSDUCTION IN MEMS
17. A 1.5–2.4 GHz tunable 4-pole filter using commercial high-reliability 5-bit RF MEMS capacitors
18. Aperture tuned antennas for 3G-4G applications using MEMS digital variable capacitor
19. Electroluminescence analysis of HFET's breakdown
20. RADIOFREQUENCY TRANSIENT BEHAVIOUR OF OHMIC RF-MEMS SWITCHES
21. Design of a MEMS Test-Structure for Stress Characterization by Capacitive Read-out
22. Non-linear electromechanical RF model of a MEMS varactor based on VerilogA© and lumped-element parasitic network
23. Non Linear Compact Modeling of RE-MEMS Switches by Means of Model Order Reduction
24. Reconfigurable MEMS-enabled LC-tank for Multi-Band CMOS Oscillator
25. The hierarchical HDL-based design of an integrated MEMS-CMOS oscillator
26. VHDL-AMS MEMS MODELING AND SIMULATION WITH MATLAB™
27. HIERARCHICAL MULTI-DOMAIN MEMS SIMULATION WITHIN AN IC-DESIGN FRAMEWORK
28. Mixed-domain simulation of intermodulation in RF-MEMS capacitive shunt switches
29. Reliability of Al/Ti gate AlGaAs/GaAs power HFETs in hydrogen gas
30. LDMOS electro-thermal model validation from large-signal time-domain measurements
31. Harmonic power generation from the non-linear output capacitance of silicon LDMOS devices
32. High power time domain measurement system with active harmonic load-pull for high efficiency base station amplifier design
33. A MEMS capacitive test structure for in-line automatic planar stress characterization
34. Direct extraction of LDMOS small signal parameters from off-state measurements
35. [Echocardiographic observations in infectious endocarditis]
36. Bulk and surface effects of hydrogen treatment on Al/Ti-gate AlGaAs/GaAs power HFETs
37. RF-MEMS Wafer-Level Packaging Using Through-Wafer Via Technology
38. Mixed-Domain Simulation of Intermodulation Distortion in RF-MEMS Capacitive Shunt Switches
39. IN & Out: cultural and productive substrate of the project
40. Mario Valentino: gli esordi e il successo nel contesto internazionale di una storica azienda napoletana
41. DESIGN FOR ENHANCEMENT OF LOCAL RESOURCES: A CASE IN COSMETIC FIELD
42. A Reconfigurable Impedance Matching Network Employing RF-MEMS Switches
43. Parasitic Effect Reduction for Wafer-Level Packaging of RF-MEMS
44. Electromagnetic Optimization of a Wafer-Level Package for RF-MEMS Applications
45. Model Order Reduction for the Extraction of Small Signal Equivalent Circuit Models of RF-MEMS
46. CAPACITIVE TEST-STRUCTURES DESIGN METHODOLOGY FOR THE EXTRACTION OF AIR-GAP AND DIELECTRIC THICKNESS OF A MEMS PROCESS
47. Hybrid Wafer-Level Packaging for RF-MEMS Applications
48. Shunt Capacitive RF-MEMS Switches Tuned for S-band Applications
49. Electrical Performance Assessment and Optimization of an RF MEMS Wafer Level Package
50. Reliability of RF-MEMS
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