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1. A Study of the Shear Response of a Lead-Free Composite Solder by Experimental and Homogenization Techniques

Author

Sivasubramaniam, V., Galli, M., Cugnoni, J., Janczak-Rusch, J., and Botsis, J.

Subjects
Morphology, lead-free, Sn-3.5Ag Solder, Ni Particles, shear test, Behavior, Evolution, homogenization, Mechanical properties, Growth, Size, Metal-Matrix Composites, Shear test, Lead-free, Composite, Homogenization, Joints, composite, Sn-Ag
Abstract

Journal of Electronic Materials, 38 (10), ISSN:0361-5235, ISSN:1543-186X

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