A Study of the Shear Response of a Lead-Free Composite Solder by Experimental and Homogenization Techniques

Authors :: Sivasubramaniam, V.
Galli, M.
Cugnoni, J.
Janczak-Rusch, J.
Botsis, J.
Source :: Journal of Electronic Materials, 38 (10)
Publisher :: Springer US
Abstract: Journal of Electronic Materials, 38 (10)<br />ISSN:0361-5235<br />ISSN:1543-186X

Subjects :: Morphology
lead-free
Sn-3.5Ag Solder
Ni Particles
shear test
Behavior
Evolution
homogenization
Mechanical properties
Growth
Size
Metal-Matrix Composites
Shear test
Lead-free
Composite
Homogenization
Joints
composite
Sn-Ag

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