1. Fast recovery of elastic constant in thin films studied by resonant-ultrasound spectroscopy.
- Author
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Nakamura, N., Nakashima, T., Ogi, H., Hirao, M., and Nishiyama, M.
- Subjects
- *
PHYSICS research , *SPECTRUM analysis , *SEMICONDUCTOR industry , *THIN films , *METALLIC films , *SEMICONDUCTOR diffusion - Abstract
This paper reports incredibly large and rapid evolution of elastic constants in deposited copper and silver films observed by the resonant-ultrasound spectroscopy. The evolution begins just after stopping the deposition with the temperature dependent recovery rate. To explain the mechanism, we propose a model, where the elastic constants at grain boundary regions increase by 67% at least. Diffusion of atoms along the grain boundary region is a possible reason, and we confirm that the activation energy is much smaller than that for grain-boundary diffusion in bulk materials. These results are explained by drastic structure change at grain boundaries, being similar to phase transition from liquid into solid phase. [ABSTRACT FROM AUTHOR]
- Published
- 2010
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