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- mrs online proceedings library9
- journal of materials science: materials in electronics8
- journal of physics d: applied physics7
- journal of x-ray science & technology6
- microelectronic engineering4
- mrs proceedings4
- mcnally, patrick j. orcid: 0000-0003-2798-5121 <https://orcid.org/0000-0003-2798-5121>, rantamaki, r., tuomi, tiinamaija, danilewsky, andreas n., lowney, donnacha, curley, john w. and herbert, p.a.f. (2001) mapping of mechanical, thermomechanical and wire-bond strain fields in packaged si integrated circuits using synchrotron white beam x-ray topography. ieee transactions on components and packaging technologies, 24 (1). pp. 76-83. issn 1521-33313
- physica status solidi (a) - applications and materials science3
- semiconductor science & technology3