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- designs4
- 2008 11th intersociety conference on thermal and thermomechanical phenomena in electronic systems3
- additive manufacturing letters3
- asme 2009 interpack conference, volume 23
- journal of electronic packaging3
- 2007 proceedings 57th electronic components and technology conference2
- 7th. int. conf. on thermal, mechanical and multiphysics simulation and experiments in micro-electronics and micro-systems2
- communications materials2
- materials2