High-Temperature Heat Pump Simulator (HeatPack) for Application in Computer Laboratory Sessions for Engineering Students

MLA

Mota-Babiloni, Adrián, et al. “High-Temperature Heat Pump Simulator (HeatPack) for Application in Computer Laboratory Sessions for Engineering Students.” Journal of Technology and Science Education, vol. 11, no. 1, Jan. 2021, pp. 16–29. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=eric&AN=EJ1303283&authtype=sso&custid=ns315887.

APA

Mota-Babiloni, A., Mateu-Royo, C., Navarro-Esbrí, J., & Barragán-Cervera, Á. (2021). High-Temperature Heat Pump Simulator (HeatPack) for Application in Computer Laboratory Sessions for Engineering Students. Journal of Technology and Science Education, 11(1), 16–29.

Chicago

Mota-Babiloni, Adrián, Carlos Mateu-Royo, Joaquín Navarro-Esbrí, and Ángel Barragán-Cervera. 2021. “High-Temperature Heat Pump Simulator (HeatPack) for Application in Computer Laboratory Sessions for Engineering Students.” Journal of Technology and Science Education 11 (1): 16–29. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=eric&AN=EJ1303283&authtype=sso&custid=ns315887.