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Bendable Silicene Membranes

Authors :
Martella, C
Massetti, C
Dhungana, D
Bonera, E
Grazianetti, C
Molle, A
Martella, Christian
Massetti, Chiara
Dhungana, Daya Sagar
Bonera, Emiliano
Grazianetti, Carlo
Molle, Alessandro
Martella, C
Massetti, C
Dhungana, D
Bonera, E
Grazianetti, C
Molle, A
Martella, Christian
Massetti, Chiara
Dhungana, Daya Sagar
Bonera, Emiliano
Grazianetti, Carlo
Molle, Alessandro
Publication Year :
2023

Abstract

Due to their superior mechanical properties, 2D materials have gained interest as active layers in flexible devices co-integrating electronic, photonic, and straintronic functions altogether. To this end, 2D bendable membranes compatible with the technological process standards and endowed with large-scale uniformity are highly desired. Here, it is reported on the realization of bendable membranes based on silicene layers (the 2D form of silicon) by means of a process in which the layers are fully detached from the native substrate and transferred onto arbitrary flexible substrates. The application of macroscopic mechanical deformations induces a strain-responsive behavior in the Raman spectrum of silicene. It is also shown that the membranes under elastic tension relaxation are prone to form microscale wrinkles displaying a local generation of strain in the silicene layer consistent with that observed under macroscopic mechanical deformation. Optothermal Raman spectroscopy measurements reveal a curvature-dependent heat dispersion in silicene wrinkles. Finally, as compelling evidence of the technological potential of the silicene membranes, it is demonstrated that they can be readily introduced into a lithographic process flow resulting in the definition of flexible device-ready architectures, a piezoresistor, and thus paving the way to a viable advance in a fully silicon-compatible technology framework.

Details

Database :
OAIster
Notes :
STAMPA, English
Publication Type :
Electronic Resource
Accession number :
edsoai.on1383764526
Document Type :
Electronic Resource