Wafer-level Hermetic Sealing of Silicon Photonic MEMS by Direct Metal-to-Metal Bonding

MLA

Jo, Gaehun, et al. Wafer-Level Hermetic Sealing of Silicon Photonic MEMS by Direct Metal-to-Metal Bonding. 2022. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsoai&AN=edsoai.on1372209615&authtype=sso&custid=ns315887.

APA

Jo, G., Edinger, P., Bleiker, S. J., Wang, X., Takabayashi, A. Y., Sattari, H., Quack, N., Jezzini, M., Lee, J. S., Malik, A. K., Verheyen, P., Zand, I., Khan, U., Bogaerts, W., Stemme, G., Gylfason, K., & Niklaus, F. (2022). Wafer-level Hermetic Sealing of Silicon Photonic MEMS by Direct Metal-to-Metal Bonding.

Chicago

Jo, Gaehun, Pierre Edinger, Simon J. Bleiker, Xiaojing Wang, Alain Yuji Takabayashi, Hamed Sattari, Niels Quack, et al. 2022. “Wafer-Level Hermetic Sealing of Silicon Photonic MEMS by Direct Metal-to-Metal Bonding.” http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsoai&AN=edsoai.on1372209615&authtype=sso&custid=ns315887.