Transient conduction analysis of multiply contacting spheres in simple three dimensional packing for powder sintering applications

MLA

Siu, Wing-Ming. Transient Conduction Analysis of Multiply Contacting Spheres in Simple Three Dimensional Packing for Powder Sintering Applications. 1997. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsoai&AN=edsoai.on1362986003&authtype=sso&custid=ns315887.

APA

Siu, W.-M. (1997). Transient conduction analysis of multiply contacting spheres in simple three dimensional packing for powder sintering applications.

Chicago

Siu, Wing-Ming. 1997. “Transient Conduction Analysis of Multiply Contacting Spheres in Simple Three Dimensional Packing for Powder Sintering Applications.” http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsoai&AN=edsoai.on1362986003&authtype=sso&custid=ns315887.