Controlling Morphology and Wettability of Intrinsically Superhydrophobic Copper-Based Surfaces by Electrodeposition

Electrodeposition is an effective and scalable method to grow desired structures on solid surfaces, for example, to impart superhydrophobicity. Specifically, copper microcrystals can be grown using electrodeposition by controlling deposition parameters such as the electrolyte and its acidity, the bath temperature, and the potential modulation. The aim of the present work is the fabrication of superhydrophobic copper-based surfaces by electrodeposition, investigating both surface properties and assessing durability under conditions relevant to real applications. Accordingly, copper-based layers were fabricated on Au/Si(100) from Cu(BF4)2 precursor by electrodeposition, using cyclic voltammetry and square-pulse voltage approaches. By increasing the bath temperature from 22 °C to 60 °C, the growth of various structures, including micrometric polyhedral crystals and hierarchical structures, ranging from small grains to pine-needle-like dendrite leaves, has been demonstrated. Without any further physical and/or chemical modification, samples fabricated with square-pulse voltage at 60 °C are superhydrophobic, with a contact angle of 160° and a sliding angle of 15°. In addition, samples fabricated from fluoroborate precursor are carefully compared to those fabricated from sulphate precursor to compare chemical composition, surface morphology, wetting properties, and durability under UV exposure and hard abrasion. Results show that although electrodeposition from fluoroborate precursor can provide dendritic microstructures with good superhydrophobicity properties, surfaces possess lower durability and stability compared to those fabricated from the sulphate precursor. Hence, from an application point of view, fabrication of copper superhydrophobic surfaces from sulphate precursor is more recommended.