Packaging/assembling technologies for a high performance SiC-based planar power module

This work is to investigate the relevant packaging / assembling technologies for developing a SiC-based planar power module which is aimed to meet the requirements such as operating temperature of -60 °C to 200 °C, SiC devices connected to 540 V DC bus and non-hermetic module. The results reported in this paper include: (i) design of a compact wire-less SiC-based power module with low parasitic inductance; (ii) demonstrated feasibility and reliability for the sintering of Ag nanoparticles and flexible printed circuit board as alternative joining and interconnect technologies which have been selected to assemble the designed power module; and (iii) preliminary construction of the designed module and electrical switching test of the constructed module.