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Solder mask surface properties and related PCBA failure due to build-up of water layer

Authors :
Lakkaraju, Anish Rao
Conseil-Gudla, Helene
Steiner, Frantisek
Ambat, Rajan
Lakkaraju, Anish Rao
Conseil-Gudla, Helene
Steiner, Frantisek
Ambat, Rajan
Source :
Lakkaraju , A R , Conseil-Gudla , H , Steiner , F & Ambat , R 2021 , ' Solder mask surface properties and related PCBA failure due to build-up of water layer ' , EUROCORR 2021 , Budapest , Hungary , 20/09/2021 - 24/09/2021 .
Publication Year :
2021

Details

Database :
OAIster
Journal :
Lakkaraju , A R , Conseil-Gudla , H , Steiner , F & Ambat , R 2021 , ' Solder mask surface properties and related PCBA failure due to build-up of water layer ' , EUROCORR 2021 , Budapest , Hungary , 20/09/2021 - 24/09/2021 .
Notes :
application/pdf, English
Publication Type :
Electronic Resource
Accession number :
edsoai.on1312790802
Document Type :
Electronic Resource

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