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Reaction injection molding and direct covalent bonding of OSTE+ polymer microfluidic devices

Authors :
Sandström, Niklas
Zandi Shafagh, Reza
Vastesson, Alexander
Carlborg, Fredrik
van der Wijngaart, Wouter
Haraldsson, Tommy
Sandström, Niklas
Zandi Shafagh, Reza
Vastesson, Alexander
Carlborg, Fredrik
van der Wijngaart, Wouter
Haraldsson, Tommy
Publication Year :
2015

Abstract

In this article, we present OSTE+RIM, a novel reaction injection molding (RIM) process that combines the merits of off-stoichiometric thiol–ene epoxy (OSTE+) thermosetting polymers with the fabrication of high quality microstructured parts. The process relies on the dual polymerization reactions of OSTE+ polymers, where the first curing step is used in OSTE+RIM for molding intermediately polymerized parts with well-defined shapes and reactive surface chemistries. In the facile back-end processing, the replicated parts are directly and covalently bonded and become fully polymerized using the second curing step, generating complete microfluidic devices. To achieve unprecedented rapid processing, high replication fidelity and low residual stress, OSTE+RIM uniquely incorporates temperature stabilization and shrinkage compensation of the OSTE+ polymerization during molding. Two different OSTE+ formulations were characterized and used for the OSTE+RIM fabrication of optically transparent, warp-free and natively hydrophilic microscopy glass slide format microfluidic demonstrator devices, featuring a storage modulus of 2.3 GPa and tolerating pressures of at least 4 bars.<br />QC 201500618

Details

Database :
OAIster
Notes :
application/pdf, English
Publication Type :
Electronic Resource
Accession number :
edsoai.on1234958287
Document Type :
Electronic Resource
Full Text :
https://doi.org/10.1088.0960-1317.25.7.075002