Massively parallel fabrication of crack-defined gold break junctions featuring sub-3 nm gaps for molecular devices

MLA

Dubois, Valentin J., et al. Massively Parallel Fabrication of Crack-Defined Gold Break Junctions Featuring Sub-3 Nm Gaps for Molecular Devices. 2018. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsoai&AN=edsoai.on1234954250&authtype=sso&custid=ns315887.

APA

Dubois, V. J., Raja, S. N., Gehring, P., Caneva, S., van der Zant, H. S. J., Niklaus, F., & Stemme, G. (2018). Massively parallel fabrication of crack-defined gold break junctions featuring sub-3 nm gaps for molecular devices.

Chicago

Dubois, Valentin J., Shyamprasad Natarajan Raja, Pascal Gehring, Sabina Caneva, Herre S. J. van der Zant, Frank Niklaus, and Göran Stemme. 2018. “Massively Parallel Fabrication of Crack-Defined Gold Break Junctions Featuring Sub-3 Nm Gaps for Molecular Devices.” http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsoai&AN=edsoai.on1234954250&authtype=sso&custid=ns315887.