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Wafer-level heterogeneous 3D integration for MEMS and NEMS
- Publication Year :
- 2012
-
Abstract
- In this paper the state-of-the-art in wafer-level heterogeneous 3D integration technologies for micro-electromechanical systems (MEMS) and nano-electromechanical systems (NEMS) is reviewed. Various examples of commercial and experimental heterogeneous 3D integration processes for MEMS and NEMS devices are presented and discussed.<br />QC 20120907
Details
- Database :
- OAIster
- Notes :
- application/pdf, English
- Publication Type :
- Electronic Resource
- Accession number :
- edsoai.on1233705255
- Document Type :
- Electronic Resource
- Full Text :
- https://doi.org/10.1109.LTB-3D.2012.6238096