Wafer-level heterogeneous 3D integration for MEMS and NEMS

MLA

Niklaus, Frank, et al. Wafer-Level Heterogeneous 3D Integration for MEMS and NEMS. 2012. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsoai&AN=edsoai.on1233369082&authtype=sso&custid=ns315887.

APA

Niklaus, F., Lapisa, M., Bleiker, S. J., Dubois, V., Roxhed, N., Fischer, A., Forsberg, F., Stemme, G., Grogg, D., & Despont, M. (2012). Wafer-level heterogeneous 3D integration for MEMS and NEMS.

Chicago

Niklaus, Frank, Martin Lapisa, Simon J. Bleiker, Valentin Dubois, Niclas Roxhed, Andreas Fischer, Fredrik Forsberg, Göran Stemme, Daniel Grogg, and Michel Despont. 2012. “Wafer-Level Heterogeneous 3D Integration for MEMS and NEMS.” http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsoai&AN=edsoai.on1233369082&authtype=sso&custid=ns315887.