Silicon interposer based QSFP-DD transceiver demonstrator with >10 Gbps/mm2 bandwidth density

Authors :: Li, C.
Raz, O.
Kraemer, F.
Stabile, R.
Li, C.
Raz, O.
Kraemer, F.
Stabile, R.
Source :: 2018 European Conference on Optical Communication, ECOC 2018, Piscataway: Institute of Electrical and Electronics Engineers. [ISBN 978-1-5386-4863-6]
Publication Year :: 2018
Abstract: Through a single optical interface, a 250 μm pitch two-dimensional 2×8-channel optical transceiver is integrated on a lithographically patterned silicon interposer, offering 200 Gb/s data input and output duplex within an area of 6 mm×6 mm.

Database :: OAIster
Journal :: 2018 European Conference on Optical Communication, ECOC 2018, Piscataway: Institute of Electrical and Electronics Engineers. [ISBN 978-1-5386-4863-6]
Notes :: Li, C.
Publication Type :: Electronic Resource
Accession number :: edsoai.on1085885754
Document Type :: Electronic Resource

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