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Multiscale modelling framework for the fracture of thin brittle polycrystalline films: Application to polysilicon

Authors :
Mulay, Shantanu S.S.
Becker, Gauthier
Vayrette, Renaud
Raskin, Jean-Pierre
Pardoen, Thomas
Galceran Mestres, Montserrat
Godet, Stéphane
Noels, Ludovic
Mulay, Shantanu S.S.
Becker, Gauthier
Vayrette, Renaud
Raskin, Jean-Pierre
Pardoen, Thomas
Galceran Mestres, Montserrat
Godet, Stéphane
Noels, Ludovic
Source :
Computational mechanics, 55 (1
Publication Year :
2015

Abstract

Micro-electro-mechanical systems (MEMS) made of polycrystalline silicon are widely used in several engineering fields. The fracture properties of polycrystalline silicon directly affect their reliability. The effect of the orientation of grains on the fracture behaviour of polycrystalline silicon is investigated out of the several factors. This is achieved, firstly, by identifying the statistical variation of the fracture strength and critical strain energy release rate, at the nanoscopic scale, over a thin freestanding polycrystalline silicon film having mesoscopic scale dimensions. The fracture stress and strain at the mesoscopic level are found to be closely matching with uniaxial tension experimental results. Secondly, the polycrystalline silicon film is considered at the continuum MEMSscale, and its fracture behaviour is studied by incorporating the nanoscopic scale effect of grain orientation. The entire modelling and simulation of the thin film is achieved by combining the discontinuous Galerkin method and extrinsic cohesive law describing the fracture process.<br />SCOPUS: ar.j<br />info:eu-repo/semantics/published

Details

Database :
OAIster
Journal :
Computational mechanics, 55 (1
Notes :
No full-text files, English
Publication Type :
Electronic Resource
Accession number :
edsoai.ocn983788880
Document Type :
Electronic Resource