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Refueling: Preventing wire degradation due to electromigration

Authors :
Universitat Politècnica de Catalunya. Departament d'Arquitectura de Computadors
Universitat Politècnica de Catalunya. ARCO - Microarquitectura i Compiladors
Abella Ferrer, Jaume
Vera Rivera, Francisco Javier
Unsal, Osman Sabri
Ergin, Oguz
González Colás, Antonio María
Tschanz, James W.
Universitat Politècnica de Catalunya. Departament d'Arquitectura de Computadors
Universitat Politècnica de Catalunya. ARCO - Microarquitectura i Compiladors
Abella Ferrer, Jaume
Vera Rivera, Francisco Javier
Unsal, Osman Sabri
Ergin, Oguz
González Colás, Antonio María
Tschanz, James W.
Publication Year :
2008

Abstract

Electromigration is a major source of wire and via failure. Refueling undoes EM for bidirectional wires and power/ground grids-some of a chip's most vulnerable wires. Refueling exploits EM's self-healing effect by balancing the amount of current flowing in both directions of a wire. It can significantly extend a wire's lifetime while reducing the chip area devoted to wires.<br />Peer Reviewed<br />Postprint (published version)

Details

Database :
OAIster
Notes :
10 p., application/pdf, English
Publication Type :
Electronic Resource
Accession number :
edsoai.ocn978332181
Document Type :
Electronic Resource