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Glass-silicon bonding technology with feed-through electrodes for micro capillary electrophoresis

Authors :
Chan, YC
Lenigk, R.
Carles, M.
Sucher, NJ
Wong, M.
Zohar, Y.
Chan, YC
Lenigk, R.
Carles, M.
Sucher, NJ
Wong, M.
Zohar, Y.
Publication Year :
2001

Abstract

A new technology approach for the design, fabrication and application of a novel integrated microsystem for micro-capillary electrophoresis is presented. The technology approach, using amorphous-silicon-assisted glass-to-silicon anodic bonding, allows the integration of feed-through electrodes formed over a thick insulating layer. In spite of the thick insulating layer and non-uniform topography, hermetic and strong bonding can be achieved due to the contribution of cc-silicon during the bonding. Electrophoresis experiments have been performed in the fabricated devices, and the transport of DNA fragments has been demonstrated. The generation of gas bubbles due to electrolysis, which can interfere with the electrophoresis process, and potential solutions are discussed.

Details

Database :
OAIster
Notes :
English
Publication Type :
Electronic Resource
Accession number :
edsoai.ocn895588634
Document Type :
Electronic Resource