用低温金属电镀技术制造与封装的惯性微型电学开关

運用光刻膠為注模的多次互不干擾金屬電鍍技術實現了慣性微型電學開關的低溫制造與封裝.電鍍技術的低溫過程可使微型開關直接成形于預先制作好的含有電子信號處理電路的基底上,加上同樣借助于低溫金屬電鍍技術的基于整個硅晶片的倒裝封裝,直接形成環繞各個器件的密封腔體.這一技術最終將使得模塊化生產成為現實.微型開關的高度和它的密封腔的高度可以分別控制.電子信號可以通過金屬互連線進入密封腔體.為了便于設計,建立了一個既簡單又相對準確的“彈簧質量塊”模型.以此設計的慣性開關,即使在未封裝的常溫、常壓條件下,均可工作109次以上.本文對密封腔體的強度和密封性,以及金屬互連線的可靠性,都作了詳細的檢測,各項指標均達到其各自的標準. Presented in this paper is a separate and non-interfering photoresist-molded, metal-electroplating technology for the low-temperature fabrication and packaging of inertia electrical micro-switch. The low temperature process of the electroplating technology allows eventual modular integration and wafer-level packaging of the micro-switches on active substrates containing pre-fabricated electronic signal-processing circuits. The height of the inertia micro-switch and that of its cavity are independently controlled. Metal leads are provided for electrical access to the sealed cavities. The switches are designed using a simple but accurate lumped spring-mass model. Un-encapsulated switches making over 100 million contacts are demonstrated in room ambient. Both the strength and the hermeticity of the sealed cavity are tested and reported.