MICROELECTRONICS ENGINEERING. DESIGN, FABRICATION, MATERIALS AND PACKAGING.

Content: Design considerations and methods using advanced electronic fabrication techniques; A survey of microelectronic technology; Vacuum technology; Guidelines for design and layout of thin-film circuits; Functional design using microelectronic techniques; Common materials encountered in microelectronics; Heat transfer design considerations for microelectronic modules; Microelectronic electrical connection techniques; Microelectronic packaging techniques. (Author)