Adherend Thermal Effects During Bonding with Inductively Heated Films

The thermal performance of an inductively heated film sandwiched between two identical adherends is investigated. Models for infinite conductivity finite thickness adherends, finite conductivity semi-infinite thickness adherends, and finite conductivity finite thickness adherends are presented. Calculations are performed for polymer-matrix composite, ceramic, and metal adherends for a variety of adherend thicknesses. The results show that for expected bonding applications, film heating rates will be reduced by a factor of l0-l00, as compared with insulated film heating rates with no attached adherends. Higher reductions in heating performance are noted for ceramic and metal adherends as compared with composite adherends. However, even with the most severe reductions in heating rates, bonding with inductively heated films is feasible.