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Pt/HTCC Alumina Based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications

Authors :
Liangyu Chen
Philip G Neudeck
David J Spry
Gary W Hunter
Publication Year :
2023
Publisher :
United States: NASA Center for Aerospace Information (CASI), 2023.

Subjects

Subjects :
Electronics and Electrical Engineering

Details

Language :
English
Database :
NASA Technical Reports
Notes :
427922.04.10.01.03, , 80GRC020D0003
Publication Type :
Report
Accession number :
edsnas.20230013082
Document Type :
Report

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