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NASA EEE Parts and NASA Electronic Parts and Packaging (NEPP) Program - Welcome to the Ninth Annual Electronics Technology Workshop (ETW)
- Publication Year :
- 2018
- Publisher :
- United States: NASA Center for Aerospace Information (CASI), 2018.
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Abstract
- This presentation includes NASA Electronic Parts and Packaging (NEPP) Program FY18 overview, key efforts, concerns, and current status.
- Subjects :
- Electronics And Electrical Engineering
Subjects
Details
- Language :
- English
- Database :
- NASA Technical Reports
- Publication Type :
- Report
- Accession number :
- edsnas.20180004165
- Document Type :
- Report