Vacuum packaging technology using localized aluminum/silicon-to-glass bonding

MLA

Cheng, Yu-T., et al. “Vacuum Packaging Technology Using Localized Aluminum/Silicon-to-Glass Bonding.” Journal of Microelectromechanical Systems, vol. 11, no. 5, Oct. 2002, p. 556. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsggo&AN=edsgcl.93085896&authtype=sso&custid=ns315887.

APA

Cheng, Y.-T., Hsu, W.-T., Najafi, K., Nguyen, C. T.-C., & Lin, L. (2002). Vacuum packaging technology using localized aluminum/silicon-to-glass bonding. Journal of Microelectromechanical Systems, 11(5), 556.

Chicago

Cheng, Yu-T., Wan-Tai Hsu, Khalil Najafi, Clark T.-C. Nguyen, and Liwei Lin. 2002. “Vacuum Packaging Technology Using Localized Aluminum/Silicon-to-Glass Bonding.” Journal of Microelectromechanical Systems 11 (5): 556. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsggo&AN=edsgcl.93085896&authtype=sso&custid=ns315887.