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A study on the forming of CICC for the superconducting tokamac device with post-forming predictions via virtual manufacturing

Authors :
Suh, Yeong Sung
Yoon, Cheon Seog
Choi, Sun Woong
Park, Hyunki
Kim, Keeman
Source :
IEEE Transactions on Applied Superconductivity. March, 2002, Vol. 12 Issue 1, p1751, 4 p.
Publication Year :
2002

Abstract

A relation between travel of the bending roller and spring back radius is described. The relation was obtained by means of virtual manufacturing with a 3-roll bending process.

Details

ISSN :
10518223
Volume :
12
Issue :
1
Database :
Gale General OneFile
Journal :
IEEE Transactions on Applied Superconductivity
Publication Type :
Academic Journal
Accession number :
edsgcl.92405720